Printed circuit board positioning mechanism
View Patent ↗In one example embodiment, a printed circuit board positioning mechanism includes a solderable plate and a compressible structure attached to the solderable plate.
1. A printed circuit board (PCB) positioning mechanism comprising:
a solderable plate that is attachable to a PCB; and
a compressible structure attached to the solderable plate such that when the mechanism is attached to the PCB, compression of the compressible structure enables substantial securement of the PCB in a first direction, wherein the compressible structure comprises dielectric silicone rubber or a metal spring.
2. The PCB positioning mechanism as recited in claim 1 , wherein the solderable plate comprises nickel.
3. The PCB positioning mechanism as recited in claim 1 , wherein the dielectric silicone rubber comprises silicone rubber KE-5620W-U.
4. A tape-and-reel system comprising:
a perforated tape; and
a plurality of PCB positioning mechanisms, each of which comprises:
a solderable plate that is attachable to a PCB; and
a compressible structure attached to the solderable plate such that when the mechanism is attached to the PCB, compression of the compressible structure enables substantial securement of the PCB in a first direction,
wherein each of the plurality of PCB positioning mechanisms is embedded in the perforated tape.
5. The tape-and-reel system as recited in claim 4 , wherein each of the plurality of PCB positioning mechanisms is embedded in the perforated tape with the solderable plate embedded more deeply than the compressible structure.
6. The tape-and-reel system as recited in claim 4 , wherein the tape-and-reel system is substantially compliant with automated solder mount technology such that each of the plurality of PCB positioning mechanisms can be soldered to a PCB using automated PCB pick-and-place component stuffing operations.
7. A PCB system comprising:
a PCB; and
a plurality of PCB positioning mechanisms soldered to the PCB, each of the PCB positioning mechanisms comprising:
a solderable plate; and
a compressible structure attached to the solderable plate such that compression of the compressible structure enables substantial securement of the PCB in a first direction.
8. The PCB system as recited in claim 7 , wherein each solderable plate comprises nickel.
9. The PCB system as recited in claim 7 , wherein the compressible structure comprises dielectric silicone rubber.
10. The PCB system as recited in claim 9 , wherein the dielectric silicone rubber comprises silicone rubber KE-5620W-U.
11. The PCB system as recited in claim 7 , wherein the compressible structure comprises a metal spring.
12. An optoelectronic transceiver module comprising:
a multi-piece shell, a first piece of the multi-piece shell defining a plurality of posts;
a PCB at least partially positioned within the multi-piece shell;
a transmitter optical subassembly (TOSA) electrically connected to the PCB;
a receiver optical subassembly (ROSA) electrically connected to the PCB; and
a plurality of PCB positioning mechanisms attached to the PCB, each of the PCB positioning mechanisms comprising:
a plate; and
a compressible structure attached to the plate
wherein each of the plurality of posts corresponds to one of the PCB positioning mechanisms such that when the first piece of the multi-piece shell is engaged with a second piece of the multi-piece shell, each of the plurality of posts compresses a corresponding compressible structure of a PCB positioning mechanism such that the PCB is substantially secured in a first direction within the optoelectronic transceiver module.
13. The optoelectronic transceiver module as recited in claim 12 , wherein the plate comprises nickel.
14. The optoelectronic transceiver module as recited in claim 12 , wherein the compressible structure comprises dielectric silicone rubber KE-5620W-U.
15. The optoelectronic transceiver module as recited in claim 12 , wherein the compressible structure comprises a metal spring.
16. The optoelectronic transceiver module as recited in claim 12 , wherein the optoelectronic transceiver module is substantially complaint with the SFP+ MSA.
17. The optoelectronic transceiver module as recited in claim 12 , wherein the optoelectronic transceiver module is substantially complaint with the XFP MSA.
18. The optoclectronic transceiver module as recited in claim 12 , wherein the plurality of PCB positioning mechanisms comprises four PG positioning mechanisms.