Semiconductor device and method for manufacturing the same

1. A method for manufacturing a semiconductor device, comprising:

forming an impurity region by introducing impurities into a semiconductor substrate;

forming an interlayer insulating film over the semiconductor substrate;

forming a contact hole reaching the impurity region in the interlayer insulating film;

forming a first conductive adhesive layer covering a wall surface of the contact hole;

forming a conductive plug by burying a conductive material in the contact hole;

forming a second conductive adhesive layer on the interlayer insulating film and the conductive plug;

forming a copper film on the second conductive adhesive layer and the interlayer insulating film;

planarizing the copper film by low-pressure chemical mechanical polishing (CMP) or electro chemical mechanical polishing (ECMP);

sequentially forming a lower electrode material film, a dielectric film made of a ferroelectric or a high dielectric, and an upper electrode material film in this order on the copper film;

forming a capacitor by patterning the upper electrode material film, the dielectric film, and the lower electrode material film;

forming a protective film over the copper film and on the capacitor; and

leaving only a part of the protective film, a part of the copper film and a part of the second conductive adhesive layer, the part of the protective film covering the capacitor, the part of the copper film which is formed under the capacitor and the part of the protective film and which is larger in width than the capacitor, and the part of the second conductive adhesive layer which is formed under the part of the copper film and which is larger in width than the capacitor, by patterning the protective film, the copper film and the second conductive adhesive layer.

2. The method for manufacturing a semiconductor device according to claim 1 , wherein a pressure at the time of the low-pressure CMP or the ECMP is equal to or more than 0.05 psi (3.45×10 2 Pa) and less than 1 psi (6.89×10 3 Pa).

3. The method for manufacturing a semiconductor device according to claim 1 , wherein the conductive material buried in the contact hole is either tungsten or polysilicon.

4. The method for manufacturing a semiconductor device according to claim 1 , wherein the first conductive adhesive layer is made of a conductive material selected from a group consisting of Ti, TiN, TiAIN, Ir, IrOx, Pt, Ru, and Ta.

5. The method for manufacturing a semiconductor device according to claim 1 , wherein the second conductive adhesive layer is made of a conductive material selected from a group consisting of Ti, TiN, TiAIN, Ir, IrOx, Pt, Ru, and Ta.

6. The method for manufacturing a semiconductor device according to claim 1 , wherein the copper film is formed by any one of a plating method, a chemical solution deposition (CSD), a chemical vapor deposition (CVD) method, a metal organic chemical vapor deposition (MOCVD) method, a liquid source chemical vapor deposition (LSCVD) method, and a physical vapor deposition (PVD) method.

7. The method for manufacturing a semiconductor device according to claim 1 , wherein a barrier metal made of a conductive material selected from a group consisting of TiAIN, Ir, and Ru is formed on the copper film, and the lower electrode of the capacitor is formed on the barrier metal.

8. The method for manufacturing a semiconductor device according to claim 1 , wherein the dielectric film is made of a dielectric selected from a group consisting of PZT, PLZT, BLT, and SBT.

9. The method for manufacturing a semiconductor device according to claim 1 , wherein only an upper surface of the capacitor, a sidewall surface of the capacitor and an upper surface of the part of the copper film are covered with the part of the protective film in the leaving of only the part of the protective film, the part of the copper film and the part of the second conductive adhesive layer.