IP Library Granted Patent US 7,924,572
Granted Patent B2
US 7,924,572 · App. 12/039,472 · Granted Apr 12, 2011

Control device and method of manufacturing thereof

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Quick Facts
Patent No.
US 7,924,572
App. No.
12/039,472
Granted
Apr 12, 2011
Kind
B2
Abstract

A module comprises a metallic terminal pins for connection and a circuit board with electronic components mounted thereon, a circuit board connecting side of the connector. The electronic components and the circuit board with the electronic components mounted thereon are encapsulated with the same resin. A metallic base is united to the module to obtain an electric conduction between the metallic base and the circuit board.

Claims (12)

1. A control device comprising:

plural electronic components for forming a control circuit;

connector pins for connecting electrically the control circuit to external equipment;

a circuit board with the connector pins and the plural electronic components installed thereon; and

a metallic member on which the circuit board is mounted, and connected electrically to the circuit board,

wherein the plural electronic components, the circuit board and a part of the connector pins are encapsulated in a resin molding compound;

the control device further comprising a metallic spacer fixed to the circuit board so as to keep a space between the circuit board and the metallic member and encapsulated with the resin molding compound together in the plural electronic components, the circuit board and the connector pins,

wherein the circuit board and the metallic member are electrically connected with each other through the metallic spacer, and

wherein the metallic spacer is provided with a disc-like projection which is formed around the metallic spacer and buried in the resin molding compound,

wherein the resin molding compound is fixed to the metallic member with a screw passing through the resin molding compound and a washer for the screw, and at least a partial region of the resin molding compound is sandwiched between the metallic member and the washer, and

wherein a thermal expansion coefficient of the resin molding compound is smaller than that of the metallic member.

2. The control device according to claim 1 , wherein the metallic spacer and the metallic member are fixed together using a screw, and the circuit board and the metallic member are electrically connected with each other through the screw.

Assignments (2)
CHANGE OF NAME Recorded Nov 30, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 058481/0935 →
DEMERGER Recorded Nov 29, 2021
From: HITACHI, LTD.
To: HITACHI AUTOMOTIVE SYSTEMS, LTD.
Reel/Frame 058960/0001 →