IP Library Granted Patent US 7,665,910
Granted Patent B2
US 7,665,910 · App. 12/039,598 · Granted Feb 23, 2010

Positioning plate for optical subassembly

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Quick Facts
Patent No.
US 7,665,910
App. No.
12/039,598
Granted
Feb 23, 2010
Kind
B2
Abstract

In one example, an optical subassembly positioning plate is provided that includes a substantially flat body that defines at least one edge. A port is defined in the body. The port is configured to receive and secure an optical subassembly in an x-direction and a y-direction when said optical subassembly positioning plate is positioned within an optoelectronic transceiver module. A plurality of fingers is defined along at least one edge of the body. Each of the plurality of fingers is configured to contact a shell of the optoelectronic transceiver module so as to bias a flange of the optical subassembly against a portion of the shell of the optoelectronic transceiver module such that the optical subassembly is substantially retained in a z-direction when the optical subassembly positioning plate is positioned within the optoelectronic transceiver module.

Claims (33)

1. An optical subassembly positioning plate comprising:

a substantially flat body defining at least one edge;

a port defined in the body, the port being configured to receive and secure an optical subassembly in an x-direction and a y-direction when the optical subassembly positioning plate is positioned within an optoelectronic transceiver module;

a plurality of fingers defined along at least one edge of the body, each of the plurality of fingers configured to contact a shell of the optoelectronic transceiver module so as to bias a flange of the optical subassembly against a portion of the shell of the optoelectronic transceiver module such that the optical subassembly is substantially retained in a z-direction when the optical subassembly positioning plate is positioned within the optoelectronic transceiver module.

2. The optical subassembly positioning plate of claim 1 , wherein the port defined in the body comprises a first port and the optical subassembly comprises a first optical subassembly, and wherein the optical subassembly positioning plate further comprises a second port defined in the body, the second port being configured to receive and secure a second optical subassembly in an x-direction and a y-direction when the optical subassembly positioning plate is positioned within the optoelectronic transceiver module.

3. The optical subassembly positioning plate of claim 1 , wherein the plurality of fingers is configured to bias the flange of the optical subassembly against a saddle of the shell.

4. The optical subassembly positioning plate of claim 1 , wherein each of the plurality of fingers is resilient and configured to dampen vibrations when the optoelectronic transceiver module is subjected to a shock force.

5. The optical subassembly positioning plate of claim 1 , wherein the body is made of sheet metal.

6. The optical subassembly of claim 1 , wherein a notch defined in the body is configured to removably secure the optical subassembly positioning plate within the shell when the optical subassembly positioning plate is positioned within the optoelectronic transceiver module.

7. An optical subassembly positioning plate comprising:

a substantially flat body defining at least one edge;

a first port defined in the body, the first port being sized and configured to receive and secure a first optical subassembly in an x-direction and a y-direction when the optical subassembly positioning plate is positioned within an optoelectronic transceiver module;

a second port defined in the body, the second port being sized and configured to receive and secure a second optical subassembly in an x-direction and a y-direction when the optical subassembly positioning plate is positioned within the optoelectronic transceiver module; and

a plurality of fingers defined along at least one edge of the body, each of the plurality of fingers configured to contact a shell of the optoelectronic transceiver module so as to bias a flange of the first optical subassembly and a flange of the second optical subassembly against a portion of the shell of the optoelectronic transceiver module such that the first and second optical subassemblies are substantially secured in a z-direction when the optical subassembly positioning plate is positioned within the optoelectronic transceiver module.

8. The optical subassembly positioning plate of claim 7 , wherein the fingers are spring-loaded.

9. The optical subassembly positioning plate of claim 7 , wherein the body is made of sheet metal.

10. The optical subassembly positioning plate of claim 7 , wherein the body includes a notch configured to engage a ridge defined within the shell.

11. The optical subassembly positioning plate of claim 10 , wherein the notch further includes biasing flanges for securing the body with the ridge.

12. The optical subassembly positioning plate of claim 7 , wherein each finger includes any member configured to resiliently bias the flange of the first optical subassembly and the flange of the second optical subassembly.

13. An optoelectronic device for use in an optical communication network, comprising:

a first optical subassembly;

a second optical subassembly;

a shell defining a slot configured to receive an optical subassembly positioning plate; and

the optical subassembly positioning plate, including:

a body, the body defining a first port and a second port, each of the first and second port being configured to receive and secure one of the first optical subassembly and the second optical subassembly, respectively, within the optoelectronic device; and

a plurality of fingers defined along at least one edge of the body, each of the plurality of fingers configured to contact the shell of the optoelectronic device so as to bias a flange of one of the first optical subassembly and the second optical subassembly against a portion of the shell.

14. The optoelectronic device of claim 13 , wherein the optical subassembly positioning plate is positioned to snugly engage with the flange of one of the first optical subassembly and the second optical subassembly.

15. The optoelectronic device of claim 13 , wherein the slot includes a ridge configured to engage a notch defined in the body of the optical subassembly positioning plate.

16. The optoelectronic device of claim 15 , wherein the ridge is configured to secure the body of the optical subassembly positioning plate by receiving biasing flanges defined in the notch.

17. The optoelectronic device of claim 13 , wherein each one of the fingers is configured to resiliently bias the flange of one of the first optical subassembly and the second optical subassembly against a saddle of the shell of the optoelectronic device.

18. The optoelectronic device of claim 13 , wherein a plurality of posts defined in the shell is configured to support the flanges of one of the first optical subassembly and the second optical subassembly.

19. The optoelectronic device of claim 13 , wherein each of the first port and the second port is configured to receive and secure one of the first optical subassembly and the second optical subassembly in an x-direction and a y-direction, and the plurality of fingers is configured to substantially secure the first optical subassembly and the second optical subassembly in a z-direction.

20. The optoelectronic device of claim 13 , wherein the optoelectronic device is substantially compliant with the SFP+ (IPF) MSA.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 4, 2008
From: MOORE, JOSHUA; ICE, DONALD A.; TOGAMI, CHRIS
To: FINISAR CORPORATION
Reel/Frame 020594/0983 →