STACKED-FILM-FORMING SYSTEM, SPUTTERING APPARATUS, AND METHOD FOR FORMING STACKED FILM
According to an aspect of an embodiment, a stacked-film-forming system for forming a stacked film has a first film-forming apparatus including a holder having a frame surrounding the substrate and a holding mechanism for holding the substrate inside the frame so that the major surface of the substrate is vertically oriented, a material emission portion for emitting a material of a first film toward the substrate held in the holder, and a shield being disposed between the holder and the material emission portion and shielding areas except for a portion of the frame from the emitted material. The portion is located at the upper part of the substrate. The stacked-film-forming system has a second film-forming apparatus for forming a second film, on the first film. The second film is made of a material different from the material of the first film.
1 . A stacked-film-forming system for forming a stacked film comprising:
a first film-forming apparatus including
a holder having a frame surrounding the substrate and a holding mechanism for holding the substrate inside the frame so that a major surface of the substrate is vertically oriented,
a material emission portion for emitting a material of a first film toward the substrate held in the holder, and
a shield being disposed between the holder and the material emission portion and shielding areas except for a portion of the frame from the emitted material, the portion being located at the upper part of the substrate; and
a second film-forming apparatus for forming on the first film a second film made of a material different from the material of the first film.
2 . The stacked-film-forming system according to claim 1 , wherein the second film-forming apparatus is an apparatus for forming the second film on the surface of the first film by a CVD method.
3 . A sputtering apparatus comprising:
a holder having a frame surrounding a substrate and a holding mechanism for holding the substrate inside the frame so that the major surface of the substrate is vertically oriented;
a material emission portion for emitting a material of a film toward the substrate held in the holder; and
a shield being disposed between the holder and the material emission portion during the formation of the film and shielding areas except for a portion of the frame from the emitted material, the portion being located at the upper part of the substrate when the holder is vertically disposed.
4 . A method for forming a stacked film comprising:
a holding step of holding the substrate in a holder having a frame surrounding a substrate and a holding mechanism for holding the substrate inside the frame so that the major surface of the substrate is vertically oriented;
a first film-forming step of forming a first film on the substrate and the holder; and
a second film-forming step of forming on the first film a second film made of a material different from a material of the first film in a state in which the substrate is held in the holder having the first film thereon.
5 . The method according to claim 4 , further comprising:
repeating the first and the second steps of forming another first and second films on the substrate and the holder.
6 . The method according to claim 4 , wherein the holder is vertically disposed in the first film-forming step.
7 . The method according to claim 4 , wherein the holder is vertically disposed in the second film-forming step.
8 . The method according to claim 4 , wherein the holder is vertically disposed in the first and the second film-forming steps.