Method for manufacturing semiconductor device
View Patent ↗A method of manufacturing a semiconductor device includes preparing a semiconductor wafer, forming a semiconductor function element on the semiconductor wafer, drying the semiconductor wafer after forming the semiconductor function element by using an isopropyl alcohol vapor, heating the semiconductor wafer after drying the semiconductor wafer, and performing a cleaning on the semiconductor wafer after heating the semiconductor wafer by using a fuming nitric acid.
1. A method of manufacturing a semiconductor device comprising:
preparing a semiconductor wafer;
forming a semiconductor function element on the semiconductor wafer;
drying the semiconductor wafer after forming the semiconductor function element by using an isopropyl alcohol vapor;
heating the semiconductor wafer after drying the semiconductor wafer; and
performing a cleaning on the semiconductor wafer after heating the semiconductor wafer by using a fuming nitric acid.
2. The method of manufacturing a semiconductor device according to claim 1 , wherein the heating step is carried out under a low pressure atmosphere.
3. The method of manufacturing a semiconductor device according to claim 2 , wherein the atmosphere includes oxygen.
4. The method of manufacturing a semiconductor device according to claim 3 , wherein the heating step is carried out for about 60 minutes in an atmosphere having a pressure of about 700 mTorr and a temperature of about 130° C. and an oxygen flow rate of about 500 SCCM (Standard Cubic Centimeter per Minute).
5. The method of manufacturing a semiconductor device according to claim 1 , wherein the forming step of a semiconductor function element includes:
forming a conducting layer on the semiconductor wafer by a sputtering process;
forming an interconnection and a bonding pad by from the conducting layer with a photolithographic and etching process;
forming a protective layer of silicon nitride over a main surface of the semiconductor wafer after forming the interconnection and the bonding pad; and
exposing only the bonding pad from the protective layer with a photolithographic and etching process.
6. The method of manufacturing a semiconductor device according to claim 5 , wherein the sputtering step is performed by sputtering an aluminum as an underlying layer, and subsequently by sputtering an aluminum alloy on the underlying layer.
7. The method of manufacturing a semiconductor device according to claim 1 , wherein the semiconductor function element is a three-axis acceleration sensor.