METHODS AND APPARATUSES TO PRODUCE INLAYS WITH TRANSPONDERS
A transponder chip module is recessed into the surface of a substrate, end portions of an antenna wire are held in place on terminal areas of the chip module by a patch which may be transparent to allow laser bonding of the wire to the terminal areas. A cover may be disposed over everything. Conductive glue or a solderable material may be used to connect the wire to the terminal areas. A recess for the chip module, and a channel for the antenna wire may be formed by laser ablation. The substrate may be Teslin™, PET/PETE or Polycarbonate. The antenna wire may have a diameter of 60 μm. A synthetic cushion material may be provided beneath the transponder chip module.
1 . Transponder inlay comprising:
a substrate having a surface;
a transponder chip module recessed into the surface of the substrate and having terminal areas;
an antenna wire disposed on the surface of the substrate and having two end portions;
the end portions of the antenna wire are disposed on the terminal areas of the chip module; and
a patch holding in place the end portions of the antenna wire to the terminal areas of the chip module.
2 . The transponder inlay of claim 1 , wherein:
the patch is transparent.
3 . The transponder inlay of claim 1 , wherein:
the patch is adhesively attached to the substrate.
4 . The transponder inlay of claim 1 , further comprising:
a generally planar cover disposed over the substrate, chip module and patch.
5 . The transponder inlay of claim 4 , wherein:
the cover comprises a coated, heavy-weight cotton material.
6 . The transponder inlay of claim 1 , wherein:
the chip module comprises a mold mass and a lead frame.
7 . The transponder inlay of claim 1 , wherein:
the chip module comprises a bumped die.
8 . The transponder inlay of claim 1 , wherein:
the substrate comprises a material selected from the group consisting of Teslin, PET/PETE, and Polycarbonate.
9 . The transponder inlay of claim 1 , wherein:
the antenna wire has a diameter of 60 μm.
10 . Method of forming a transponder inlay comprising:
recessing a transponder chip module in a surface of a substrate, wherein the chip module has terminal areas;
mounting a wire to the surface of the substrate and forming an antenna;
passing end portions of the antenna wire over the terminal areas; and
placing a patch over the chip module with the wire ends of the antenna positioned over the terminals areas of the chip module.
11 . The method of claim 10 , wherein the patch is transparent, and further comprising:
using a laser to bond the end portions of the antenna wire to the terminal areas by passing the beam through the transparent patch.
12 . The method of claim 10 , further comprising:
applying a dollop of conductive glue or solderable material to an interface between the end portions of the wire and the terminal areas.
13 . The method of claim 12 , wherein the patch is transparent, and further comprising:
using a laser to heat the conductive glue or solderable material.
14 . The method of claim 10 , wherein:
the patch is adhesively secured to the substrate.
15 . The method of claim 10 , wherein:
the patch is hot laminated to the substrate.
16 . The method of claim 10 , wherein:
the chip module is recessed into the substrate by pressing the chip module against the substrate using thermal energy.
17 . The method of claim 10 , wherein:
the chip module is recessed into the substrate by milling a recess for receiving the transponder chip into the surface of the substrate.
18 . The method of claim 17 , further comprising:
performing the milling with a laser.
19 . The method of claim 17 , further comprising:
mounting a cover over the substrate, including the transponder chip module, wire and patch.
20 . Method of forming a transponder inlay comprising:
mounting a chip module to a substrate;
mounting an antenna wire to the substrate;
connecting end portions of the antenna wire to terminal areas of the chip module using a laser; and
performing at least one of:
removing insulation from end portions of the wire;
forming a recess in the substrate using laser ablation; and
forming a channel for the antenna wire in the substrate.
21 . The method of claim 20 , further comprising:
mounting a cover over the substrate, including the chip module and antenna wire.
22 . A method of forming a recess in a substrate for a transponder chip module comprising:
forming a recess for the transponder chip module in a surface of the substrate, wherein the recess extends only partially through the substrate.
23 . The method of claim 22 , wherein a laser is used to form the recess by ablating material from the substrate.
24 . The method of claim 23 , wherein the laser is scanned across the surface of the substrate to form the recess.
25 . The method of claim 22 , wherein the substrate comprises Teslin.
26 . The method of claim 22 , further comprising:
providing synthetic cushion material, in the recess, between the transponder chip module and the substrate.
27 . A method of mounting an antenna wire to a surface of a substrate for a transponder chip comprising:
forming a channel for the antenna wire in the surface of the substrate; and
laying down the wire into the channel.
28 . The method of claim 27 , wherein the channel is U-shaped.
29 . The method of claim 27 , wherein the channel is formed by a mechanical tool, or by a hot mold process, or by a laser.
30 . The method of claim 27 , wherein the channel has a depth which is less than a diameter of the wire, and as the wire is laid down into the channel, it is pressed further into the substrate.
31 . The method of claim 27 , wherein the substrate comprises Teslin.