IP Library Granted Patent US 7,883,768
Granted Patent B2
US 7,883,768 · App. 12/045,869 · Granted Feb 8, 2011

Backlight module, diffusion plate and method of manufacturing the same

Assignee: Beijing Boe Optoelectronics Technology Co., Ltd.
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Quick Facts
Patent No.
US 7,883,768
App. No.
12/045,869
Granted
Feb 8, 2011
Kind
B2
Abstract

Disclosed is a diffusion plate and a method of manufacturing thereof and a backlight module including the diffusion plate. The diffusion plate comprises a substrate and a diffusion layer applied on the substrate. The diffusion layer comprises a polymer resin and polymer hollow microspheres, and the polymer hollow microspheres are uniformly dispersed in the polymer resin.

Claims (17)

1. A diffusion plate, comprising:

a substrate; and

a diffusion layer provided on the substrate, wherein the diffusion layer comprises a polymer resin and polymer hollow microspheres, and the polymer hollow microspheres are uniformly dispersed in the polymer resin, wherein the polymer hollow microspheres are composed of an outer polymer layer and at least one inner hollow portion, wherein there are a plurality of inner hollow portions in one of the polymer hollow microspheres, and wherein the cross sections of the plurality of inner hollow portions have different shapes.

2. The diffusion plate of claim 1 , wherein the diffusion layer has a thickness of from about 25 to about 50 μm.

3. The diffusion plate of claim 1 , wherein the cross section of the outer polymer layer has a shape of circle or ellipse.

4. The diffusion plate of claim 1 , wherein the material used for the substrate and the polymer resin is PMMA and polyester, respectively.

5. The diffusion plate of claim 1 , further comprising an antitack layer provided on the other side of the substrate opposite to the diffusion layer.

6. A backlight module, comprising the diffusion plate of claim 1 .

7. The backlight module according to claim 6 , further comprising a light source and a light guiding board.

8. A method of manufacturing a diffusion plate, comprising the steps of:

providing polymer hollow microspheres;

mixing the polymer hollow microspheres into a polymer resin uniformly;

applying uniformly the polymer resin mixed with the polymer hollow microspheres to a substrate; and

curing the polymer resin to form a diffusion layer, the diffusion layer comprises the polymer resin and polymer hollow microspheres and the polymer hollow microspheres are uniformly dispersed in the polymer resin, wherein the polymer hollow microspheres are composed of an outer polymer layer and at least one inner hollow portion, wherein there are a plurality of inner hollow portions in one of the polymer hollow microspheres, and wherein the cross sections of the plurality of inner hollow portions have different shapes.

9. The method of claim 8 , wherein curing the polymer resin is performed by photo-curing or thermal curing.

10. The method of claim 8 , further comprising a step of providing an antitack layer on the other side of the substrate opposite to the diffusion layer.

11. The method of claim 8 , wherein the diffusion layer has a thickness of from about 25 to about 50 μm.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2015
From: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD
To: BOE TECHNOLOGY GROUP CO., LTD.; BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO. LTD
Reel/Frame 036644/0601 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 11, 2008
From: YU, HONGJUN
To: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 020789/0830 →
Priority Claims (1)
CN 200710098703 · Apr 25, 2007 · national
Continuity (1)
Related Publication 20080268234A1 · Oct 30, 2008