Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards
View Patent ↗A wirebonder for electrically connecting an integrated circuit die with conductors on a printed circuit board. The wirebonder has a bonding tool for attaching wire bonds from the integrated circuit die to the conductors of the printed circuit board and a wire engaging structure for deforming the wire bonds such that they have a flatter profile shape.
1. A wirebonder for electrically connecting an integrated circuit die with conductors on a printed circuit board, the wirebonder comprising:
a bonding tool having a wedge with a tip for bonding wire bonds to the conductors of the printed circuit board; and,
a wire deforming structure fixedly mounted to the bonding tool for movement therewith such that the wire deforming structure remains stationary with respect to the bonding tool, the wire deforming structure having a tip fixedly positioned at 50 microns to 600 microns below the tip of the wedge such that the wire deforming structure deforms the wire bonds, wherein the tip of the wire deforming structure is formed from a material that has a hardness less than that of aluminium.
2. A wirebonder according to claim 1 wherein the wire deforming structure pushes on the wire bonds to plastically deform them.
3. A wirebonder according to claim 1 wherein the wire deforming structure is flexible relative to the bonding tool.
4. A wirebonder according to claim 1 wherein the bonding tool moves from the integrated circuit to the conductors when forming one of the wire bonds and the wire deforming structure has a wire pushing surface positioned 1.0 mm to 1.6 mm behind the bonding tool with respect to its direction of movement when forming the wire bonds.
5. A wirebonder according to claim 1 wherein the wire bonds are formed from lengths of wire with a gauge between 15 microns and 75 microns.
6. A wirebonder according to claim 5 wherein the gauge is about 25 microns.
7. A wirebonder according to claim 1 wherein the wire bonds attach to respective contact pads on the IC die and the wire bonds do not extend more than 150 microns above the contact pads of the IC die.
8. A wirebonder according to claim 7 wherein the line of wire bonds does not extend more than 50 microns above the contact pads of the IC die.
9. A wirebonder according to claim 7 wherein the contact pads are spaced from the corresponding conductors on the PCB by more than 1 mm.
10. A wirebonder according to claim 9 wherein the contact pads are between 2 mm and 3 mm from the corresponding conductors on the PCB.
11. A wirebonder according to claim 1 wherein the PCB is a flexible PCB mounted to a support structure together with the die such that the conductors are adjacent the contact pads on the die.
12. A wirebonder according to claim 11 wherein the support structure has a chip mounting area for supporting the die, the die having a back surface in contact with the chip mounting area and an active surface opposing the back surface, the active surface having the contact pads, and the chip mounting area being raised relative to the remainder of the support structure such that the contact pads are raised relative to the conductors.
13. A wirebonder according to claim 12 wherein the active surface has functional elements spaced less than 260 microns from the contacts pads of the die.
14. A wirebonder according to claim 1 wherein the die is an inkjet printhead IC and the functional elements are nozzles through which ink is ejected.
15. A wirebonder according to claim 14 wherein the printhead IC is configured to be mounted in a printer such that during use the nozzles are less than 100 microns from the paper path.