IP Library Patent Application 12046551
Patent Application
App. No. 12/046,551

METHOD FOR MANUFACTURING SOLAR CELL, AND THE SOLAR CELL

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Quick Facts
Patent No.
US None
App. No.
12/046,551
Abstract

In accordance with the present invention, the method for manufacturing the solar cell includes: forming a dividing groove 8 a that reaches a n-type single crystal silicon substrate 1 in a thickness direction of a photoelectric conversion part 10; and fracturing the photoelectric conversion part 10 along the dividing groove 8 a, wherein the dividing groove 8 a is formed continuously in an inside of an outer circumference portion of the photoelectric conversion part 10.

Claims (14)

1 . A method for manufacturing a solar cell, comprising:

forming a photoelectric conversion part that includes a semiconductor substrate;

forming collecting electrodes on the photoelectric conversion part;

forming a dividing groove that reaches the semiconductor substrate in a thickness direction of the photoelectric conversion part; and

fracturing the photoelectric conversion part along the dividing groove,

wherein the dividing groove is formed continuously in an inside of an outer circumference portion of the photoelectric conversion part.

2 . The method for manufacturing a solar cell according to claim 1 , wherein the dividing groove is formed without having any apexes.

3 . The method for manufacturing a solar cell according to either one of claims 1 ,

wherein the dividing groove is composed of linear grooves and curved grooves, and

a shortest distance between each of the curved grooves and the outer circumference portion of the photoelectric conversion part is smaller than a shortest distance between each of the linear grooves and the outer circumference portion of the photoelectric conversion part.

4 . A solar cell, comprising:

a photoelectric conversion part that includes a semiconductor substrate; and

collecting electrodes formed on the photoelectric conversion part,

wherein each of all side surfaces of the photoelectric conversion part includes processed surface formed by fracturing the semiconductor substrate.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2015
From: SANYO ELECTRIC CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 035071/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2015
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 035071/0508 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 27, 2008
From: KANNOU, HIROYUKI; SHIMA, MASAKI
To: SANYO ELECTRIC CO., LTD.
Reel/Frame 020713/0520 →