IP Library Granted Patent US 7,963,823
Granted Patent B2
US 7,963,823 · App. 12/046,785 · Granted Jun 21, 2011

Machining machine with means for acquiring machining parameters

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,963,823
App. No.
12/046,785
Granted
Jun 21, 2011
Kind
B2
Abstract

A machining machine with an upper rotatingly drivable machining disc, the annular machining plane of which has a machining coating and is facing a lower machining plane, wherein the machining planes form a machining gap between each other. Plural rotor discs are arranged in the gap, which accommodate workpieces in recesses and which can be brought into rotation by means of a roll-off device, wherein the workpieces move along a cycloid path, wherein plural sensor elements for acquiring at least one machining parameter are arranged in the upper machining disc, distributed across its cross section, the sensor elements are each one coupled to an active or passive RFID chip and a reading device is assigned to the upper machining disc for reading out the RFID chips.

Claims (8)

1. A machining machine with an upper rotatingly drivable machining disc, said disc having an upper annular machining plane which has a machining coating, and in which said upper machining plane faces a lower machining plane, wherein the machining planes form a machining gap between each other, in which are arranged plural rotor discs, which accommodate workpieces in recesses and which can be brought into rotation by means of a rolling device, whereby they move along a cycloid path, and in which plural sensor elements for acquiring at least one machining parameter are arranged in the upper machining disc, distributed across its cross section, said sensor elements each being coupled to an active or passive RFID chip, said machine further including a reading device which is assigned to the upper machining disc for reading out the RFID chips, and wherein the sensor elements with RFID chips are arranged in plural planes, said planes being parallel spaced apart and running parallel to the upper machining plane.

2. A machining machine according to claim 1 , wherein the plural sensor elements with the RFID chips are approximately uniformly distributed across the cross section of the machining disc.

3. A machining machine according to claim 1 , wherein the sensor elements with the RFID chips are arranged along a radius of the machining plane.

4. A machining machine according to claim 1 , wherein at least one of the sensor elements and the antenna of the RFID chips have a resonant frequency that changes in relation with the distance of the machining plane from the sensor element and in which the change of the resonant frequency can be read out.

5. A machining machine according to claim 1 , wherein the sensor elements are pressure sensors.

6. A machining machine according to claim 1 , wherein the sensor elements are temperature sensors.

7. A machining machine according to claim 1 , wherein the upper machining plane is formed by a multiplicity of segments bonded to each other, and the sensor elements with RFID chips are assigned to individual segments.

8. A machining machine according to claim 7 , wherein an optical fiber is integrated into the segments, which connects the outer side of the segments with their backside.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Jan 20, 2017
From: MB FINANCIAL BANK, N.A., AS ADMINISTRATIVE AGENT
To: LAPMASTER GROUP HOLDINGS LLC; LAPMASTER INTERNATIONAL, LLC; BATES TECHNOLOGIES, LLC; LAPMASTER WOLTERS LIMITED; LAPMASTER WOLTERS (SHENYANG) PRECISION MACHINERY CO., LTD.; NHL SUB GMBH; LAPMASTER WOLTERS GMBH; FORMATEC HOLDING B.V.; LAPMASTER WOLTERS JAPAN KABUSHIKI KAISHA
Reel/Frame 041025/0377 →
SECURITY INTEREST Recorded Nov 10, 2015
From: LAPMASTER GROUP HOLDINGS LLC; LAPMASTER INTERNATIONAL, LLC; BATES TECHNOLOGIES, LLC; LAPMASTER WOLTERS LIMITED; LAPMASTER WOLTERS (SHENYANG) PRECISION MACHINERY CO., LTD; NHL SUB GMBH; LAPMASTER WOLTERS GMBH; FORMATEC HOLDING B.V.; LAPMASTER WOLTERS JAPAN KABUSHIKIKAISHA
To: MB FINANCIAL BANK, N.A. AS ADMINISTRATIVE AGENT
Reel/Frame 037080/0023 →