Method and apparatus for breaking surface tension during a recessed color filter array process
View Patent ↗A method of making a color filter array of an imaging device comprises forming a main recess for a color filter array, forming a tension breaking feature at an edge of the main recess, and providing a color filter array material across the tension breaking feature and main recess as part of forming the color filter array. The tension breaking feature reduces the settling distance of the color filter array material. An imaging device having the thus formed color filter array is also described.
1. An imaging device, comprising:
a main recess;
a surface tension breaking feature arranged at an edge of the main recess, wherein the surface tension breaking feature comprises a trench, wherein the trench has a surface interposed between first and second edges, wherein the first edge is closer to the main recess than the second edge, and wherein the second edge is defined by a wall that extends above the surface; and
a color filter array arranged in the main recess.
2. The imaging device of claim 1 , wherein the trench is arranged adjacent to the main recess in a step configuration.
3. The imaging device of claim 2 , wherein the trench is one of a plurality of trenches arranged adjacent to the main recess in a staircase configuration.
4. The imaging device of claim 1 , wherein the tension breaking feature comprises an additional wall separating the trench from the main recess.
5. The imaging device of claim 4 , wherein the depth of the trench is the same as the depth of the main recess.
6. The imaging device of claim 4 , wherein the depth of the trench is less than the depth of the main recess.
7. The imaging device of claim 6 , further comprising an etch stop, and wherein the depth of the trench is defined by the position of the etch stop.
8. An imaging device, comprising:
a main recess;
a surface tension breaking feature arranged at an edge of the main recess; and
a color filter array arranged in the main recess, wherein the tension breaking feature comprises a first trench separated from the main recess by a first wall and a second trench separated from the first trench by a second wall.
9. The imaging device of claim 8 , wherein the first trench and the second trench have the same width.
10. The imaging device of claim 8 , wherein the first trench and the second trench have different widths.
11. The imaging device of claim 1 , wherein the surface tension breaking feature surrounds the main recess.
12. The imaging device of claim 8 , wherein the depth of a first portion of the first trench and the depth of a first portion of the second trench are less than the main recess and the depth of a second portion of the first trench and the depth of a second portion of the second trench are the same as the depth of the main recess.
13. The imaging device of claim 12 , further comprising at least one etch stop, and wherein the depth of the first portion of the first trench and the depth of the first portion of the second trench are defined by the position of the at least one etch stop.
14. The imaging device of claim 8 , wherein the depth of the first trench is less than the depth of the second trench.
15. The imaging device of claim 14 , further comprising an etch stop, and wherein the depth of the first trench is defined by the position of the etch stop.
16. The imaging device of claim 1 , wherein the main recess is arranged in a stack comprising a first material, a second material arranged on the first material, and a third material arranged on the second material.
17. An imaging device, comprising:
a main recess;
a surface tension breaking feature arranged at an edge of the main recess; and
a color filter array arranged in the main recess, wherein the main recess is arranged in a stack comprising a first material, a second material arranged on the first material, and a third material arranged on the second material, and wherein the tension breaking feature comprises a trench arranged in the third material and a recess arranged in the first material.
18. The imaging device of claim 1 , wherein the main recess is arranged in a stack comprising a substrate material, a first material arranged on the substrate material, and a second material arranged on the first material.
19. The imaging device of claim 18 , wherein the wall and the trench are arranged in the second material.
20. The imaging device of claim 19 , wherein the wall is separated from the main recess by the trench.
21. An imaging system comprising:
a processor circuit; and
an imaging device coupled to said processor circuit and comprising a pixel array, and said pixel array comprising,
a main recess,
at least one surface tension breaking feature arranged at an edge of the main recess, wherein the at least one surface tension breaking feature comprises a trench, wherein the trench has a surface interposed between first and second edges, wherein the first edge is closer to the main recess than the second edge, and wherein the second edge is defined by a wall that extends above the surface, and
a color filter array arranged in the main recess.
22. The imaging system of claim 21 , wherein the at least one tension breaking feature further comprises an additional wall separating the trench from the main recess.
23. An imaging system comprising: a processor circuit; and
an imaging device coupled to said processor circuit and comprising a pixel array, and said pixel array comprising,
a main recess,
at least one surface tension breaking feature arranged at an edge of the main recess, and
a color filter array arranged in the main recess, wherein the main recess is arranged in a stack comprising a first material, a second material arranged on the first material, and a third material arranged on the second material and wherein at least one tension breaking feature comprises a trench arranged in the third material and a recess arranged in the first material.
24. The imaging system of claim 21 , wherein the main recess is arranged in a stack comprising a substrate, a first material arranged on the substrate, and a second material arranged on the first material and wherein the wall and the trench are arranged in the second material.