IP Library Granted Patent US 7,901,144
Granted Patent B2
US 7,901,144 · App. 12/049,062 · Granted Mar 8, 2011

Optical interconnect solution

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Quick Facts
Patent No.
US 7,901,144
App. No.
12/049,062
Granted
Mar 8, 2011
Kind
B2
Abstract

A low-cost, high-speed optical interconnect replacement for current electrical interconnects on printed circuit boards is provided. The invention achieves its goal by including an optical transmitter module or optical receiver module mounted in close proximity to a modulator used to encode optical signals from electrical impulses or decode optical signals to electrical impulses. A bare optical fiber is then used to transmit the signal from an optical encoding source to an optical receiver, providing a high-speed method of replacement for traditional electrical interconnects.

Claims (2)

1. A microconnection between two printed circuit boards, said microconnection including a single bare optical fiber having two ends, wherein one end is engaged to a first microconnection on a first printed circuit board, and wherein the other end is engaged with a second microconnection on a second printed circuit board, wherein each of said microconnections includes a retention means for holding said bare fiber end including a detent, a cap made from a durable material that permits light transmission therethrough, wherein when said bare fiber end is present within said retention means and flush against said detent, said bare fiber end is simultaneously in contact with said cap, and a transmitter and/or receiver module to send and/or receive spatial transmissions from said bare optical fiber through both of said cap and said lens, and wherein said bare fiber end is in direct contact with said cap and said cap is in direct contact with said lens.

2. The micro-connection of claim 1 wherein said bare optical fiber permits information to be transferred between printed circuit boards at a transfer rate of at least 10 Gb/s.

Assignments (4)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →