Mini optical subassembly
View Patent ↗A low-cost, high-speed micro-connector replacement for current electrical inter-connects and intra-connects on printed circuit boards is provided. The invention achieves its goal by including an optical transmitter module or optical receiver module mounted in close proximity to a modulator used to encode optical signals from electrical impulses or decode optical signals to electrical impulses. The micro-connector is mounted on a PCB in alignment with the transmitting or receiving modules and provides appropriate alignment and stop positioning of an optical fiber used for optical transmitting between transmitting/receiving modules.
1. A mini optical subassembly comprised of an optical package at a first end and an optical micro-connector receiving a bare optical fiber at a second end; wherein said optical micro-connector includes a bore into which said bare optical fiber is received and which includes a movable retaining mechanism external to said bore in order to secure and release said bare optical fiber when received within said bore; and wherein said optical micro-connector comprises a lens and a transparent protective cover in direct contact with said lens such that when said bare optical fiber is received therein, said bare optical fiber is in direct contact with said protective cover.
2. The subassembly of claim 1 wherein said optical package comprises a submount assembly including a) a first side comprising electrical leads which extend from the submount and connected to either laser drive circuitry for a transmitter assembly or receiver circuitry for a receiver assembly and b) a second side comprising a laser or detector mounted directly to said submount.
3. The subassembly of claim 2 wherein said submount assembly is composed of material selected from the group consisting of ceramic, silicon, and glass.
4. A method of transferring information through converting electrical impulses into optical signals between two printed circuit boards via the subassembly of claim 1 .
5. A method of transferring information through converting electrical impulses into optical signals between two printed circuit boards via the subassembly of claim 2 .
6. A method of transferring information through converting electrical impulses into optical signals between two printed circuit boards via the subassembly of claim 3 .