Nozzle assembly having a sprung electromagnetically operated plunger
View Patent ↗The invention provides for a nozzle assembly for a printer. The assembly includes a substrate and drive circuitry on the substrate. A plurality of layers is stacked on the substrate to define an ink chamber with an ink ejection port. A magnetic plunger is positioned within the ink chamber below the ejection port. Also included is a toroidal electromagnet device connected to the drive circuitry, positioned about the plunger and fast with the stack layer, and a number of springs connecting the electromagnet device and the plunger, to restrict movement of the plunger relative to the electromagnet device.
1. A nozzle assembly for a printer, said assembly comprising:
a substrate;
drive circuitry on the substrate;
a plurality of layers stacked on the substrate to define an ink chamber with an ink ejection port;
a magnetic plunger positioned within the ink chamber between the substrate and the ejection port;
a toroidal electromagnet device positioned about the plunger and fast with the stack layer to be connected to the drive circuitry; and
a number of springs connecting the electromagnet device and the plunger, to restrict movement of the plunger relative to the electromagnet device.
2. The nozzle assembly of claim 1 , wherein the electromagnetic device includes a nickel-ferrous material which surrounds a copper current carrying wire core with a first end of the copper coil connected to a first portion of a nickel-ferrous material and a second end of the copper coil connected to a second portion of the nickel-ferrous material.
3. The nozzle assembly of claim 1 , wherein the plunger is of a nickel-ferrous material (NiFe), said plunger including tapered end portions.
4. The nozzle assembly of claim 1 , wherein the springs are of a nitride material.
5. The nozzle assembly of claim 1 , wherein the plurality of layers include a bottom layer defining the ejection port, a silicon layer on top thereof, a glass layer on top of the silicon layer, and a passivation layer fast with the electromagnet device.
6. The nozzle assembly of claim 5 , wherein the bottom layer is formed by back etching a silicon wafer which has a boron doped epitaxial layer as an etch stop.
7. The nozzle assembly of claim 6 , wherein the boron doped layer is individually masked and etched to form a nozzle rim about the nozzle ejection port.