Printhead assembly laminated ink distribution stack
View Patent ↗The invention provides for an elongate printhead assembly for a pagewidth printer. The printhead assembly includes a printed circuit board (PCB) having mounted thereon various electronic components to facilitate operation of the printer. A number of printhead integrated circuits are respectively angularly disposed with respect to a longitudinal axis of the PCB. Tape automated bond (TAB) film is in register with a number of printhead integrated circuits. The film is configured to arrange the integrated circuits in signal communication with the electronic components. The assembly also includes an ink distribution molding for distributing ink from an ink reservoir to the integrated circuits, and a laminated stack arranged between the ink distribution molding and the integrated circuits for ducting the ink to respective integrated circuits.
1. An elongate printhead assembly for a pagewidth printer, the printhead assembly comprising:
a printed circuit board (PCB) having mounted thereon various electronic components to facilitate operation of the printer;
a number of printhead integrated circuits respectively angularly disposed with respect to a longitudinal axis of the PCB;
tape automated bond (TAB) film in register with a number of the printhead integrated circuits, said film configured to arrange the integrated circuits in signal communication with the electronic components;
an ink distribution molding for distributing ink from an ink reservoir to the integrated circuits; and
a laminated stack arranged between the ink distribution molding and the integrated circuits for ducting the ink to respective integrated circuits, the integrated circuits being mounted on the stack wherein
successive integrated circuits overlap at least partially with respect to each other;
wherein each integrated circuit is electronically connected to an end of the tape automated bond (TAB) film, the other end of which is maintained in electrical contact with an undersurface of the printed circuit board by means of a TAB film backing pad mounted to a plastics duct cover.
2. The printhead assembly of claim 1 , wherein the various electronic components include 64 MB DRAM, a print engine controller (PEC) integrated circuit, a QA integrated circuit connector, a microcontroller, and a dual motor driver integrated circuit.
3. The printhead assembly of claim 1 , wherein the distribution molding includes the plastics duct cover forming a lid of the distribution molding, the plastics duct cover having integrally molded therewith individual ink inlet ports to which ink hoses are connected.
4. The printhead assembly of claim 3 , wherein the distribution molding includes six individual longitudinal ink ducts and an air duct which extend throughout the length of the molding.
5. The printhead assembly of claim 1 , wherein the laminated stack includes a number of laminated layers forming a laminated ink distribution stack, the layers of the laminate formed from a micro-molded plastics material.