Organic light-emitting display device and method of manufacturing the same
View Patent ↗An organic light-emitting display device includes a substrate; a gate electrode disposed on the substrate, the gate electrode including a first portion of a metal oxide layer and a metal layer; a pixel electrode disposed on the substrate so as to be insulated from the gate electrode, the pixel electrode including a second portion of the metal oxide layer; a gate insulating layer disposed on the substrate to cover the gate electrode; a semiconductor layer disposed on the gate insulating layer, the semiconductor layer including a channel region corresponding to the gate electrode, and first and second regions disposed outside the channel region; a first electrode connected to the first region of the semiconductor layer; a second electrode connected to the second region of the semiconductor layer and the pixel electrode; an ohmic contact layer disposed between the first region of the semiconductor layer and the first electrode and between the second region of the semiconductor layer and the second electrode; a pixel defining layer disposed on the substrate to cover the first electrode, the second electrode, the semiconductor layer, and the pixel electrode, the pixel defining layer including an opening through which the pixel electrode is partially exposed; an organic light-emitting layer disposed on the pixel electrode exposed through the opening; and an opposite electrode covering the organic light-emitting layer.
1. A method of manufacturing an organic light-emitting display device, the method comprising:
depositing a material for forming a gate electrode and a pixel electrode on a substrate and patterning the material to form the gate electrode and the pixel electrode so that the gate electrode and the pixel electrode are insulated from each other, wherein the deposited material for forming the gate electrode and the pixel electrode comprises a metal layer formed on the substrate and a metal oxide layer formed on the metal layer and wherein, when the metal layer and metal oxide layer are patterned to form the gate electrode and the pixel electrode, each of the formed gate electrode and the pixel electrode comprises a patterned portion of the metal layer and a patterned portion of the metal oxide layer contacting the metal layer, wherein the patterned portion of the metal layer is between the metal oxide layer and the substrate;
depositing a gate insulating material on the gate electrode and the pixel electrode;
depositing an amorphous silicon layer on the gate insulating material;
crystallizing the amorphous silicon layer to form a polycrystalline silicon layer;
depositing an ohmic contact material on the polycrystalline silicon layer;
patterning the gate insulating material, the polycrystalline silicon layer, and the ohmic contact material so that the pixel electrode is exposed to thereby form a gate insulating layer, a semiconductor layer, and an ohmic contact layer that are separated from the pixel electrode;
depositing a conductive material on the substrate, the ohmic contact layer, and the pixel electrode, and patterning the conductive material so that the ohmic contact layer corresponding to the gate electrode is exposed to thereby form a first electrode that is connected to the ohmic contact layer and a second electrode that is separated from the first electrode and that is connected to the ohmic contact layer and the pixel electrode;
etching an exposed portion of the ohmic contact layer;
depositing a pixel defining layer forming material on the substrate, the first and second electrodes, the semiconductor layer, and the pixel electrode and patterning the pixel defining layer forming material so that the pixel electrode is exposed to form a pixel defining layer; and
forming an organic light-emitting layer and an opposite electrode on the pixel electrode.
2. The method of claim 1 , wherein in the formation of the gate insulating layer, the semiconductor layer, and the ohmic contact layer, the gate insulating material, the polycrystalline silicon layer, and the ohmic contact material are patterned so that the metal oxide layer of the pixel electrode is exposed.
3. The method of claim 1 , wherein in the formation of the gate insulating layer, the semiconductor layer, and the ohmic contact layer, the gate insulating material, the polycrystalline silicon layer, and the ohmic contact material are patterned so that ends of the gate insulating layer, the semiconductor layer, and the ohmic contact layer have the same pattern.
4. The method of claim 1 , further comprising forming a buffer layer on the substrate.
5. A method of manufacturing an organic light-emitting display device, the method comprising:
simultaneously forming a gate electrode and a pixel electrode by depositing a material for forming the gate electrode and the pixel electrode on a substrate and patterning the material to form the gate electrode and the pixel electrode so that the gate electrode and the pixel electrode are insulated from each other,
wherein the material for forming the gate electrode and the pixel electrode comprises a metal layer formed on the substrate and a metal oxide layer formed on the metal layer and wherein, when material is patterned to form the gate electrode and the pixel electrode, each of the formed gate electrode and the pixel electrode comprises a patterned portion of the metal layer and a patterned portion of the metal oxide layer contacting the metal layer, wherein the patterned portion of the metal layer is between the metal oxide layer and the substrate.