INTEGRATED HEAT EXCHANGERS IN A RACK FOR VERTICAL BOARD STYLE COMPUTER SYSTEMS
A system for cooling heat-generating objects, such as computer boards situated in a rack, includes an enclosure in which the heat generating objects are situated. The enclosure has an air inlet and an air outlet, and a fan induces airflow into the air inlet, through the enclosure and out the air outlet. A heat exchanger is situated in the enclosure such that the heat exchanger is in a spaced apart relationship with the heat-generating object. Air moving through or past the heat-generating object is warmed, and the heat exchanger removes the heat before the air exits the enclosure.
1 - 18 . (canceled)
19 . A enclosure for cooling heat generating objects, comprising:
at least a cabinet portion and a door portion, the enclosure having an air inlet and an air outlet;
at least one rack located in the cabinet portion for operatively connecting at least one heat generating object;
a fan associated with the enclosure for inducing air into the housing through the air inlet, establishing air flow within the housing and expelling air out of the housing through the air outlet;
an air-to-fluid heat exchanger located in the cabinet portion and in the air flow path between the air inlet and the heat generating object; and
whereby the air expelled from the housing is substantially the same temperature as the air entering the enclosure.
20 . The enclosure of claim 19 , wherein the fan is situated adjacent the air outlet and outside of the housing.
21 . The enclosure of claim 19 , wherein the fan is situated adjacent the air inlet and outside of the housing.
22 . The enclosure of claim 19 , wherein the location of the fan is selected from the group consisting of: adjacent the air inlet and outside the housing; adjacent the air inlet and inside the housing; adjacent the air outlet and outside the housing; and adjacent the air outlet and inside the housing.
23 . The enclosure of claim 19 , further comprising a second air-to-fluid heat exchanger located between the heat generating object and the air outlet.
24 . The enclosure of claim 19 , wherein the air-to-fluid heat exchanger is a micro-channel heat exchanger.
25 . The enclosure of claim 24 , wherein the heat exchanger is adapted to transfer heat from the air to a refrigerant.
26 . The enclosure of claim 25 , wherein the refrigerant is a two-phase refrigerant.
27 . The enclosure of claim 19 , further comprising a plurality of racks, each rack adapted to operatively connect a plurality of vertically-oriented heat generating objects to the rack.
28 . The enclosure of claim 27 , further comprising at least one heat exchanger located between each rack.
29 . The enclosure of claim 28 , wherein the at least one heat exchanger located between each rack is an air-to-fluid heat exchanger.
30 . The enclosure of claim 29 , wherein the at least one heat exchanger located between each rack is a micro-channel heat exchanger.
31 . The enclosure of claim 30 , wherein the at least one heat exchanger located between each rack is adapted to transfer heat from the air to a refrigerant.
32 . The enclosure of claim 31 , wherein the refrigerant is a two-phase refrigerant.
33 . A method for cooling heat generating objects located within an enclosure, comprising:
providing an enclosure comprising at least a cabinet portion and a door portion, the enclosure having an air inlet and an air outlet;
locating at least one rack within the cabinet portion for operatively connecting at least one heat generating object to the rack;
associating a fan with the enclosure to induce air into the housing through the air inlet;
placing an air-to-fluid heat exchanger in the cabinet portion and in an air flow path between the air inlet and the rack to transfer heat from the air;
establishing air flow through the heat exchanger and across the rack to transfer heat to the air; and
expelling air out of the housing through the air outlet at substantially the same temperature as the air entering the inlet.
34 . The method of claim 33 , wherein associating the fan comprises locating the fan adjacent the air outlet and outside of the housing.
35 . The method of claim 33 , wherein associating the fan comprises locating the fan adjacent the air inlet and outside of the housing.
36 . The method of claim 33 , wherein associating the fan is selected from the group consisting of: adjacent the air inlet and outside the housing; adjacent the air inlet and inside the housing; adjacent the air outlet and outside the housing; and adjacent the air outlet and inside the housing.
37 . The method of claim 33 , further comprising placing a second air-to-fluid heat exchanger between the rack and the air outlet.
38 . The method of claim 33 , wherein the air-to-fluid heat exchanger is a micro-channel heat exchanger.
39 . The method of claim 38 , wherein the heat exchanger is adapted to transfer heat from the air to a refrigerant.
40 . The method of claim 39 , wherein the refrigerant is a two-phase refrigerant.
41 . The method of claim 33 , further comprising locating a plurality of racks within the cabinet portion, each rack adapted to operatively connect a plurality of vertically oriented-heat generating objects to the rack.
42 . The method of claim 41 , further comprising placing at least one heat exchanger between each rack.
43 . The method of claim 42 , wherein the at least one heat exchanger between each rack is an air-to-fluid heat exchanger.
44 . The method of claim 43 , wherein the at least one heat exchanger between each rack is a micro-channel heat exchanger.
45 . The method of claim 44 , wherein the at least one heat exchanger located between each rack is adapted to transfer heat from air to a refrigerant.
46 . The method of claim 45 , wherein the refrigerant is a two-phase refrigerant.