LED light source module and LED backlight module using the same
View Patent ↗A LED light source module includes a printed circuit board and a plurality of LEDs. The printed circuit board has a plurality of through holes arranged in intervals. Each of the LEDs includes at least one LED chip and at least one metal board. The metal board has a supporting surface. The LED chip is arranged on the supporting surface. At least one of the LED chip and the metal board is contained in each through hole of the printed circuit board corresponding to the LED including the at least one of the LED chip and the metal board. Each of the LEDs electrically is connected with printed circuit board through the supporting surface of the metal board to make the LED chip be connected with the printed circuit board electrically.
1. A light source module, comprising:
a printed circuit board, having a plurality of through holes arranged in intervals; and
a plurality of light emitting diodes packaged independent of the printed circuit board, each of the packaged light emitting diodes including at least one chip, at least one metal board and a package, the metal board having a supporting surface, the chip being arranged on the supporting surface, the package being arranged on the supporting surface to seal the chip therein, at least one of the chip and the metal board being contained in the through hole of the printed circuit board corresponding to the light emitting diode including the at least one of the chip and the metal board, and each of the light emitting diodes electrically being connected with the printed circuit board through the metal board and such that the chip is connected with the printed circuit board electrically by the supporting surface of the metal board.
2. The light source module as claimed in claim 1 , wherein the chip of each of the light emitting diodes is contained in the through hole of the printed circuit board corresponding to the light emitting diode including the chip, and the metal boards of the light emitting diodes are arranged at one side of the printed circuit board in intervals and electrically connected with the printed circuit board.
3. The light source module as claimed in claim 2 , wherein the size of the metal board of each of the light emitting diodes is larger than that of the through hole of the printed circuit board corresponding to the light emitting diode including the metal board.
4. The light source module as claimed in claim 1 , wherein the metal board of each of the light emitting diodes is contained in the through hole of the printed circuit board corresponding to the light emitting diode including the metal board, and the metal board is electrically connected with the printed circuit board through the supporting surface and a linear conductor of the printed circuit board.
5. The light source module as claimed in claim 4 , wherein the thickness of the metal board is the same as that of the printed circuit board.
6. The light source module as claimed in claim 1 , wherein each of the light emitting diodes includes a plurality of chips, and the chips include at least one of red, green, and blue light emitting diode chips.
7. The light source module as claimed in claim 1 , wherein the metal board is a metal core printed circuit board.
8. A backlight module, comprising:
a light guide plate;
a light source module including a printed circuit board and a plurality of light emitting diodes packaged independent of the printed circuit board, the printed circuit board having a plurality of through holes arranged in intervals, each of the packaged light emitting diodes including at least one chip, at least one metal board and a package, the metal board having a supporting surface, the chip being arranged on the supporting surface, the package being arranged on the supporting surface to seal the chip therein, at least one of the chip and the metal board being contained in the through hole corresponding to the light emitting diode including the at least one of the chip and the metal board, and each of the light emitting diodes electrically being connected with the printed circuit board through the metal board and such that the chip is connected with the printed circuit board electrically by the supporting surface of the metal board; and
a metal back frame cooperating with the light guiding plate to define a containing space, the light source module being arranged in the containing space, and each of the light emitting diodes is connected with the metal back frame through a surface of the metal board opposite to the supporting surface of the metal board.
9. The backlight module as claimed in claim 8 , further comprising a plurality of fixing elements being arranged in alternation with the through holes of the printed circuit board, passing through the printed circuit board from a side of the printed circuit board facing towards the light guide plate, and extending into the metal back frame to fix the light source module and the metal back frame.
10. The backlight module as claimed in claim 8 , wherein the chip of each of the light emitting diodes is contained in the through hole of the printed circuit board corresponding to the light emitting diode including the chip, and the metal boards of the light emitting diodes are arranged at one side of the printed circuit board in intervals and electrically connected with the printed circuit board.
11. The backlight module as claimed in claim 10 , wherein the size of the metal board of each of the light emitting diodes is larger than that of the through hole of the printed circuit board corresponding to the light emitting diode including the metal board.
12. The backlight module as claimed in claim 8 , wherein the metal board of each of the light emitting diodes is contained in the through hole of the printed circuit board corresponding to the light emitting diode including the metal board, and the metal board is electrically connected with the printed circuit board through the supporting surface and a linear conductor of the printed circuit board.
13. The backlight module as claimed in claim 12 , wherein the thickness of the metal board is the same as that of the printed circuit board.
14. The backlight module as claimed in claim 8 , wherein the metal board is a metal core printed circuit board.
15. The backlight module as claimed in claim 8 , wherein the each of the light emitting diodes includes a plurality of chips, and the chips include at least one of the red, green and blue light emitting diode chips.
16. A light source module comprising:
a printed circuit board, having a plurality of through holes arranged in intervals; and
a plurality of light emitting diodes, each of the light emitting diodes including a chip and a metal board, the chip being arranged on a supporting surface of the metal board, at least one of the chip and the metal board being contained in a corresponding one of the through holes of the printed circuit board, and each of the light emitting diodes being electrically connected with the printed circuit board by using a surface mount technology and such that the chip is electrically connected with the printed circuit board through the supporting surface of the metal board.