PIXEL STRUCTURE WITH A PHOTODETECTOR HAVING AN EXTENDED DEPLETION DEPTH
An image sensor includes an imaging area that includes a plurality of pixels that are formed in a substrate layer of a first conductivity type. Each pixel includes a collection region that is formed in a portion of the substrate layer and doped with a dopant of a first conductivity type. A plurality of wells are disposed in portions of the substrate layer and doped with another dopant of the second conductivity type. Each well is positioned laterally adjacent to each collection region. A buried layer spans the imaging area and is disposed in a portion of the substrate layer that is beneath the photodetectors and the wells. The buried layer is doped with a dopant of a second conductivity type. Each collection region, each well, and the buried layer are formed such that a region of the substrate layer having substantially the same doping as the substrate layer resides between each collection region and the buried layer.
1 . An image sensor comprising:
an imaging area that includes a plurality of pixels each having a collection region doped with a dopant of a first conductivity type;
a substrate layer of the first conductivity type;
a buried layer spanning the imaging area and disposed in a portion of the substrate layer, wherein the buried layer is doped with a dopant of a second conductivity type; and
a plurality of wells disposed in portions of the substrate layer with each well positioned laterally adjacent to each collection region in each pixel, wherein each well is doped with another dopant of the second conductivity type, and wherein the buried layer and each collection region are formed such that a region of the substrate layer having substantially the same doping as the substrate layer resides between each collection region and the buried layer.
2 . The image sensor of claim 1 , further comprising one or more electronic components disposed in each pixel.
3 . The image sensor of claim 1 , further comprising one or more electronic components disposed in the substrate layer outside of the imaging area and electrically connected to the imaging area.
4 . The image sensor of claim 1 , wherein each well is disposed in a portion of the substrate layer such that each well abuts the buried layer.
5 . The image sensor of claim 1 , further comprising a pinning layer formed over each collection region to form a pinned photodiode.
6 . The image sensor of claim 1 , wherein the substrate layer comprises a substrate with an epitaxial layer formed thereon, and wherein the buried layer, the plurality of wells, and the collection regions are formed in portions of the epitaxial layer.
7 . The image sensor of claim 1 , wherein the substrate layer comprises a substrate, and wherein the buried layer, the plurality of wells, and the collection regions are formed in portions of the substrate.
8 . The image sensor of claim 1 , wherein the first conductivity type is p type and the second conductivity type is n type.
9 . An image capture device comprising:
an image sensor comprising:
an imaging area that includes a plurality of pixels each having a collection region doped with a dopant of a first conductivity type;
a substrate layer of the first conductivity type;
a buried layer spanning the imaging area and disposed in a portion of the substrate layer, wherein the buried layer is doped with a dopant of a second conductivity type;
a plurality of wells disposed in portions of the substrate layer with each well positioned laterally adjacent to each collection region in each pixel, wherein each well is doped with another dopant of the second conductivity type, and wherein the buried layer and each collection region are formed such that a region of the substrate layer having substantially the same doping as the substrate layer resides between the buried layer and each collection region.
10 . The image capture device of claim 9 , wherein the image sensor further comprises one or more electronic components disposed in each pixel.
11 . The image capture device of claim 9 , further comprising one or more electronic components disposed in the substrate layer outside of the imaging area and electrically connected to the imaging area.
12 . The image capture device of claim 9 , wherein the first conductivity type is p type and the second conductivity type is n type.
13 . The image capture device of claim 9 , further comprising a pinning layer formed over each collection region to form a pinned photodiode.
14 . The image capture device of claim 9 , wherein the substrate layer comprises a substrate with an epitaxial layer formed thereon, and wherein the buried layer, the plurality of wells, and the collection regions are formed in portions of the epitaxial layer.
15 . The image capture device of claim 9 , wherein the substrate layer comprises a substrate, and wherein the buried layer, the plurality of wells, and the collection regions are formed in portions of the substrate.