Sensor for thermal analysis and systems including same
View Patent ↗Certain embodiments disclosed herein are directed to a sensor comprising a support member, a sample sensor coupled to the support member and comprising a sample support electrically coupled to a first set of interconnects, and a reference sensor coupled to the support member and comprising a ring coupled to a second set of interconnects, in which the ring is positioned adjacent to and surrounding at least a portion of the sample support of the sample sensor.
1. A sensor comprising:
a support member;
a sample sensor coupled to the support member and comprising a sample support electrically coupled to a first set of interconnects; and
a reference sensor coupled to the support member and comprising a ring coupled to a second set of interconnects, in which the ring is positioned adjacent to and surrounding at least a portion of the sample support of the sample sensor.
2. The sensor of claim 1 , further comprising a connector coupled to the support member, the connector configured to couple the sensor to a balance.
3. The sensor of claim 1 , further comprising a controller coupled to the first set of interconnects and the second set of interconnects.
4. The sensor of claim 1 , in which the sample support and the ring of the reference sensor are both platinum.
5. The sensor of claim 1 , wherein the reference sensor is configured to provide a reference signal without the addition of an external reference material.
6. The sensor of claim 1 , in which the sample support comprises a concave surface configured to receive a crucible comprising a sample.
7. The sensor of claim 1 , in which the ring of the reference sensor is a cylindrical ring with an inner surface positioned less than 0.5 mm from an outer surface of the sample support.
8. The sensor of claim 7 , in which the ring comprises an outer diameter of 6 mm to 8 mm and an inner diameter of 5 mm to 7 mm.
9. A system for simultaneous thermal analysis, the system comprising:
a heating system comprising a furnace thermally coupled to a sensor comprising
a support member;
a sample sensor coupled to the support member and comprising a sample support electrically coupled to a first set of interconnects; and
a reference sensor coupled to the support member and comprising a ring coupled to a second set of interconnects, in which the ring is positioned adjacent to and surrounding at least a portion of the sample support of the sample sensor; and
a controller coupled to the heating system and configured to receive signals from the first and second set of interconnects of the sensor.
10. The system of claim 9 , further comprising a gas control system coupled to the heating system.
11. The system of claim 9 , further comprising an analytical device coupled to the simultaneous thermal analysis system, the analytical device selected from the group consisting of a mass spectrometer, an infrared spectrometer, a gas chromatograph and combinations thereof.
12. The system of claim 9 , further comprising a computer system coupled to the simultaneous thermal analysis system.
13. The system of claim 9 , further comprising an autosampling system coupled to the heating system.
14. The system of claim 9 , further comprising a balance coupled to the sensor.
15. The system of claim 14 , in which the simultaneous thermal analysis system is configured for thermogravimetric analysis and at least one of differential thermal analysis and differential scanning calorimetry.
16. A method of measuring thermal properties of a sample comprising:
placing a sample on a sample support of a sensor in a furnace, the sensor comprising a sample support and a reference sensor adjacent to and surrounding at least a portion of the sample support;
altering the temperature in the furnace to promote a physical or chemical change in the sample; and
measuring the physical or chemical change in the sample using the sample sensor and the reference sensor.
17. The method of claim 16 , further comprising measuring the physical or chemical change without adding an external reference material to the reference sensor.
18. The method of claim 16 , further comprising measuring a change in mass of the sample and a change in temperature of the sample during the temperature altering step.
19. A method of facilitating measurement of thermal properties of a sample comprising providing a sensor configured with a support member, a sample sensor coupled to the support member and comprising a sample support electrically coupled to a first set of interconnects, and a reference sensor coupled to the support member and comprising a ring coupled to a second set of interconnects, in which the ring is positioned adjacent to and surrounding at least a portion of the sample support of the sample sensor.