Method for manufacturing a tunnel junction magnetoresistive sensor with improved performance and having a CoFeB free layer
View Patent ↗A method for manufacturing a magnetoresistive sensor that provides increased magnetoresistive performance. The method includes forming a series of sensor layers with at least one layer containing CoFeB, and having a first capping layer thereover. A high temperature annealing is performed to optimize the grains structure of the sensor layers. The first capping layer is then removed, such as by reactive ion etching (RIE). An antiferromagnetic layer is then deposited followed by a second capping layer. A second annealing is performed to set the magnetization of the pinned layer, the second annealing being performed at a lower temperature than the first annealing.
1. A method for manufacturing a tunnel junction magnetoresistive sensor, comprising:
depositing a series of sensor layers including at least one magnetic layer comprising cobalt-iron-boron (CoFeB), and a first capping layer formed at the top of the series of sensor layers;
performing a first annealing,
removing the first capping layer;
depositing a layer of antiferromagnetic material;
depositing a second capping layer; and
performing a second annealing, the second annealing being performed a lower temperature than the first annealing.
2. A method as in claim 1 , wherein the first annealing is performed at a temperature of between 300 and 400 degrees Celsius and the second annealing is performed at a temperature of 200 to 300 degrees Celsius.
3. A method as in claim 1 , further comprising, after removing the first capping layer, performing a cleaning operation.
4. A method as in claim 1 , further comprising, after removing the first capping layer, performing a low power plasma treatment in an atmosphere containing Ar and H 2 .
5. A method as in claim 1 , further comprising, after removing the first capping layer, performing a cleaning operation, and then depositing a magnetic refill layer.
6. A method as in claim 1 , further comprising, after removing the first capping layer, performing a low power plasma treatment in an atmosphere containing Ar and H 2 , and then depositing a CoFe refill layer.
7. A method as in claim 1 , wherein the first and second capping layers each comprise Ta.
8. A method as in claim 1 , wherein the series of sensor layers further comprises:
a magnetic free layer comprising CoFeB;
a non-magnetic, electrically insulating barrier layer deposited over the magnetic free layer; and
a pinned layer structure comprising a layer of CoFeB deposited over the non-magnetic, electrically insulating harrier layer.
9. A method as in claim 1 , wherein the series of sensor layers further comprises:
a magnetic free layer comprising CoFeB;
a non-magnetic, electrically insulating barrier layer deposited over the magnetic free layer;
a first magnetic pinned layer comprising CoFeB deposited over the non-magnetic, electrically insulating barrier layer;
a Ru antiparallel coupling layer deposited over the first magnetic pinned layer; and
a second magnetic pinned layer comprising CoFe deposited over the Ru antiparallel coupling layer.
10. A method as in claim 9 wherein the second pinned layer has about 40 atomic percent Fe.
11. A method as in claim 1 , wherein the series of sensor layers further comprises:
a magnetic free layer comprising CoFeB;
a non-magnetic, electrically insulating barrier layer deposited over the magnetic free layer;
a first magnetic pinned layer comprising CoFeB deposited over the non-magnetic, electrically insulating barrier layer;
a Ru antiparallel coupling layer deposited over the first magnetic pinned layer; and
a second magnetic pinned layer comprising CoFe with about 40 atomic percent Fe deposited over the Ru antiparallel coupling layer, the first capping layer being deposited over the second magnetic pinned layer; the method further comprising, after removing the first capping layer:
performing a low power plasma treatment to clean the second magnetic pinned layer; and
depositing a CoFe refill layer on the cleaned surface of the second pinned layer,
the CoFe refill layer having about 40 atomic percent Fe.