Stack combination of plural chip package units
A combination includes a first chip package unit and a second chip package unit on which the first chip package unit is placed. Each of the first and second chip package units includes a substrate having a first surface, a second surface, a chip package electrically connected to the first surface, and a plurality of bonding pads formed on the first and second surfaces. The bonding pads on the first surface of the first chip package unit are respectively electrically connected with the bonding pads on the surface of the second chip package unit. The chip packages electrically connected to the first surfaces are enclosed by the substrates, and the bonding pads on the second surfaces are configured as interface terminals of the combination.
1. A combination comprising:
a first chip package unit stacked on a second chip package unit, each of the first and second chip package units comprising:
a substrate having a first surface, a second surface, a chip package electrically connected to the first surface, and a plurality of bonding pads formed on the first and second surfaces,
wherein a center of the first surface of the substrate of the first chip package unit defines a stepped recess portion, such that the substrate of the first chip package unit comprises a horizontal main body and two opposite side walls extending perpendicularly from the main body, with each of the side walls defining an outer high portion and an inner low step, the chip package of the first chip package unit being received between the inner low steps, and the bonding pads of the first surface of the substrate of the first chip package unit being located on the outer high portions and the inner low steps,
the substrate of the second chip package unit comprises a horizontal main body and two opposite side walls extending perpendicularly from the main body, each of the side walls defines an inner high portion and an outer low step, and the bonding pads of the first surface of the substrate of the second chip package unit are located on the inner high portions and the outer low steps,
the bonding pads on the first surface of the first chip package unit are respectively electrically connected with the bonding pads on the first surface of the second chip package unit, with the bonding pads of the outer high portions of the first surface of the substrate of the first chip package unit being electrically connected with the bonding pads of the outer low steps of the first surface of the substrate of the second chip package unit, and the bonding pads of the inner low steps of the first surface of the substrate of the first chip package unit being electrically connected with the bonding pads of the inner high portions of the first surface of the substrate of the second chip package unit, and
the chip packages electrically connected to the first surfaces are enclosed by the substrates, and the bonding pads on the second surfaces of the substrates of the first and second chip package units are configured as interface terminals of the combination.
2. The combination as claimed in claim 1 , wherein the bonding pads on the first surfaces surround the chip packages respectively.
3. The combination as claimed in claim 1 , wherein an additional chip package unit is electrically connected on the second surface of the substrate of the first chip package unit.
4. The combination as claimed in claim 3 , wherein the first chip package unit comprises an additional chip package on the second surface thereof.
5. The combination as claimed in claim 4 , wherein the chip packages on the first chip package unit are centrally set.
6. The combination as claimed in claim 1 , wherein the first chip package unit comprises an additional chip package on the second surface thereof, and the second chip package unit comprises an additional chip package on the second surface thereof.