Process of manufacturing a wood fiberboard, in particular floor panels
View Patent ↗A wood fiberboard, in particular floor panel, includes an HDF support board with a top side and an underside, the top side having a decoration, preferably a wood or tile decoration, is distinguished in that the decoration is printed directly onto the top side of the support board and is covered by at least one layer of a transparent synthetic resin.
1. A process for producing a wood fiberboard comprising:
printing a decoration directly onto a surface of a board;
spreading one or more synthetic-resin layers onto the board, directly over the decoration printed directly onto a surface of the board; and
pressing the synthetic-resin layers.
2. The process according to claim 1 , wherein the printing is performed directly on a top surface of the board.
3. The process according to claim 2 , wherein the printing is performed directly on a bottom surface of the board.
4. The process according to claim 1 , further comprising stamping into the synthetic-resin layer which corresponds to the printed decoration.
5. The process according to claim 1 , further comprising sawing floor panels from the wood fiberboard.
6. The process according to claim 1 , wherein the board is made of one of HDF, MDF, and chipboard, and further comprising covering the top side by a paper free layer of a transparent synthetic resin.
7. The process according to claim 1 , wherein the decoration printed on the board is of a wood or tile.
8. A process for producing a wood fiberboard comprising:
printing a decoration directly onto a surface of one or two sides of the board;
spreading, by use of a screen roller, one or more synthetic-resin layers of melamine-resin or urea-resin layers directly on a side of the board with the decoration and sides located opposite the decoration; and
pressing the synthetic-resin layers.
9. The process according to claim 8 , wherein a first synthetic-resin layer applied to the decoration is provided with corundum particles.
10. The process according to claim 8 , further comprising, in a short cycle press, stamping a relief which corresponds to the decoration on a top side into the synthetic-resin layer.
11. The process according to claim 10 , further comprising stamping a relief which corresponds to the decoration on an underside.
12. The process according to claim 10 , further comprising sawing floor panels from the wood fiberboard.
13. The process according to claim 8 , wherein the decoration is printed directly onto at least one of a top side and underside of the board.
14. The process according to claim 13 , further comprising sawing floor panels from the wood fiberboard.
15. The process according to claim 8 , further comprising sawing floor panels from the wood fiberboard.
16. The process according to claim 8 , wherein the wood fiberboard comprises an HDF support board with a top side and an underside, the top side having the decoration printed thereon and covered by at least one layer of a transparent synthetic resin.
17. The process according to claim 8 , wherein the decoration is printed onto an underside of the board.
18. The process according to claim 8 , wherein the decoration is printed directly onto a top side of the board and the board is made of one of HDF, MDF, and chipboard, and further comprising covering the top side by a paper free layer of a transparent synthetic resin.
19. The process according to claim 8 , wherein the decoration is printed onto a top side of the board and is covered by at least one layer of a transparent synthetic resin, wherein the board is made of one of HDF, MDF, and chipboard, and further comprising forming a relief on the top side which corresponds to the decoration.
20. The process according to claim 8 , wherein the decoration printed on the board is of a wood or tile.