IP Library Granted Patent US 7,737,472
Granted Patent B2
US 7,737,472 · App. 12/061,947 · Granted Jun 15, 2010

Semiconductor integrated circuit device

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Quick Facts
Patent No.
US 7,737,472
App. No.
12/061,947
Granted
Jun 15, 2010
Kind
B2
Abstract

A semiconductor integrated circuit device capable of suppressing variations in transistor characteristics due to the well proximity effect is provided. Standard cell rows are arranged in a vertical direction, each standard cell row including standard cells arranged in a horizontal direction. In the standard cell rows, positions of the N well and the P region in the vertical direction are switched every other row. Adjacent standard cell rows share the P region or the N well. A distance from a PMOS transistor located at an end of a standard cell row to an end of an N well is greater than or equal to a width of an N well shared by standard cell rows.

Claims (105)

1. A semiconductor integrated circuit device comprising:

a circuit block including a plurality of standard cell rows arranged in a vertical direction, each standard cell row including standard cells arranged in a horizontal direction,

wherein each of the standard cell rows includes an N well and a P region extending in the horizontal direction and adjacent to each other in the vertical direction,

each of the standard cells has a PMOS transistor formed in the N well and an NMOS transistor formed in the P region,

in the standard cell rows, positions of the N well and the P region in the vertical direction are switched every other row, the first and second standard cell rows share the P region, and the second and third standard cell rows share the N well,

in at least one of the standard cell rows, a distance from a PMOS transistor located at least one end thereof to an end closer to the PMOS transistor in the horizontal direction of the N well is greater than or equal to a shared-N well width which is a width in the vertical direction of the N well shared by the second and third standard cell rows.

2. The semiconductor integrated circuit device of claim 1 , wherein

in the at least one standard cell row, each of the standard cells has a distance in the horizontal direction from the PMOS transistor to an end of the N well, the distance being greater than or equal to the shared-N well width.

3. The semiconductor integrated circuit device of claim 1 , wherein

in the at least one standard cell row, a dummy cell having an N well is arranged closer to the outside than the standard cell having the PMOS transistor.

4. The semiconductor integrated circuit device of claim 3 , wherein

the dummy cell is a standard cell which does not share an input/output with any other standard cells.

5. The semiconductor integrated circuit device of claim 3 , wherein

the dummy cell includes an inter-powerline capacitance element, a diode element, a dummy gate which is not connected to any other elements, or a dummy wire which is not connected to any other elements.

6. The semiconductor integrated circuit device of claim 1 , wherein

a width in the vertical direction of the N well in the first standard cell row is greater than or equal to the shared-N well width.

7. The semiconductor integrated circuit device of claim 1 , wherein

the P region is a P well.

8. A semiconductor integrated circuit device comprising:

a first circuit block and a second circuit block each including a plurality of standard cell rows arranged in a vertical direction, each standard cell row including standard cells arranged in a horizontal direction,

wherein each of the standard cell rows includes an N well and a P region extending in the horizontal direction and adjacent to each other in the vertical direction,

each of the standard cells has a PMOS transistor formed in the N well and an NMOS transistor formed in the P region,

in the standard cell rows of each of the first and second circuit block, positions of the N well and the P region in the vertical direction are switched every other row, the first and second standard cell rows share the P region, and the second and third standard cell rows share the N well,

a height in the vertical direction of the standard cell in the second circuit block is greater than a height in the vertical direction of the standard cell in the first circuit block,

in at least one of the standard cell rows in the second circuit block, a distance from a PMOS transistor located at least one end thereof to an end closer to the PMOS transistor in the horizontal direction of the N well is greater than or equal to a width in the vertical direction of the N well shared by the second and third standard cell rows in the first circuit block.

9. A semiconductor integrated circuit device comprising:

a circuit block including a plurality of standard cell rows arranged in a vertical direction, each standard cell row including standard cells arranged in a horizontal direction,

wherein each of the standard cell rows includes an N well and a P region extending in the horizontal direction and adjacent to each other in the vertical direction,

each of the standard cells has a PMOS transistor formed in the N well and an NMOS transistor formed in the P region,

in the standard cell rows, positions of the N well and the P region in the vertical direction are switched every other row, the first and second standard cell rows share the P region, and the second and third standard cell rows share the N well,

a width in the vertical direction of the N well in the first standard cell row is greater than or equal to a shared-N well width which is a width in the vertical direction of the N well shared by the second and third standard cell rows, and

each of the standard cells has a width in the vertical direction of the N well greater than or equal to the shared-N well width.

10. A semiconductor integrated circuit device comprising:

a circuit block including a plurality of standard cell rows arranged in a vertical direction, each standard cell row including standard cells arranged in a horizontal direction,

wherein each of the standard cell rows includes an N well and a P region extending in the horizontal direction and adjacent to each other in the vertical direction,

each of the standard cells has a PMOS transistor formed in the N well and an NMOS transistor formed in the P region,

in the standard cell rows, positions of the N well and the P region in the vertical direction are switched every other row, the first and second standard cell rows share the P region, and the second and third standard cell rows share the N well,

a dummy cell row having dummy cells arranged in the horizontal direction, each dummy cell having an N well, is arranged closer to the outside than the first standard cell row with the N well being shared with the dummy cell row and the first standard cell row, and

a width in the vertical direction of the N well shared by the first standard cell row and the dummy cell row is greater than or equal to a shared-N well width which is a width in the vertical direction of the N well shared by the second and third standard cell rows.

11. The semiconductor integrated circuit device of claim 10 , wherein

the dummy cell is a standard cell which does not share an input/output with any other standard cells.

12. The semiconductor integrated circuit device of claim 10 , wherein

the dummy cell includes an inter-powerline capacitance element, a diode element, a dummy gate which is not connected to any other elements, or a dummy wire which is not connected to any other elements.

13. The semiconductor integrated circuit device of claim 10 , wherein

the dummy cell does not have a P region.

14. A semiconductor integrated circuit device comprising:

a circuit block including a plurality of standard cell rows arranged in a vertical direction, each standard cell row including standard cells arranged in a horizontal direction,

wherein each of the standard cell rows includes an N well and a P well extending in the horizontal direction and adjacent to each other in the vertical direction,

each of the standard cells has a PMOS transistor formed in the N well and an NMOS transistor formed in the P well,

in the standard cell rows, positions of the N well and the P well in the vertical direction are switched every other row, the first and second standard cell rows share the N well, and the second and third standard cell rows share the P well, and

a width in the vertical direction of the P well in the first standard cell row is greater than or equal to a width in the vertical direction of the P well shared by the second and third standard cell rows.

15. The semiconductor integrated circuit device of claim 14 , wherein

a dummy cell row having dummy cells arranged in the horizontal direction is arranged closer to the outside than the first standard cell row with the P well being shared with the dummy cell row and the first standard cell row.

16. A semiconductor integrated circuit device comprising:

a circuit block including a plurality of standard cell rows arranged in a vertical direction, each standard cell row including standard cells arranged in a horizontal direction,

wherein each of the standard cell rows includes an N well and a P well extending in the horizontal direction and adjacent to each other in the vertical direction,

each of the standard cells has a PMOS transistor formed in the N well and an NMOS transistor formed in the P well,

in the standard cell rows, positions of the N well and the P well in the vertical direction are switched every other row, the first and second standard cell rows share the N well, and the second and third standard cell rows share the P well, and

in at least one of the standard cell rows, a distance from an NMOS transistor located at least one end thereof to an end closer to the NMOS transistor in the horizontal direction of the P well is greater than or equal to a shared-P well width which is a width in the vertical direction of the P well shared by the second and third standard cell rows.

17. The semiconductor integrated circuit device of claim 16 , wherein

the N well and the P well possessed by each of the standard cell rows are formed on a triple well which is an N well.

18. The semiconductor integrated circuit device of claim 16 , wherein

in the at least one standard cell row, each of the standard cells has a distance in the horizontal direction from the NMOS transistor to an end of the P well, the distance being greater than or equal to the shared-P well width.

19. The semiconductor integrated circuit device of claim 16 , wherein

in the at least one standard cell row, a dummy cell having a P well is arranged closer to the outside than the standard cell having the PMOS transistor.

20. The semiconductor integrated circuit device of claim 19 , wherein

the dummy cell is a standard cell which does not share an input/output with any other standard cells.

21. The semiconductor integrated circuit device of claim 19 , wherein

the dummy cell includes an inter-powerline capacitance element, a diode element, a dummy gate which is not connected to any other elements, or a dummy wire which is not connected to any other elements.

22. The semiconductor integrated circuit device of claim 16 , wherein

a width in the vertical direction of the P well in the first standard cell row is greater than or equal to the shared-P well width.

23. A semiconductor integrated circuit device comprising:

a first circuit block and a second circuit block each including a plurality of standard cell rows arranged in a vertical direction, each standard cell row including standard cells arranged in a horizontal direction,

wherein each of the standard cell rows includes an N well and a P well extending in the horizontal direction and adjacent to each other in the vertical direction,

each of the standard cells has a PMOS transistor formed in the N well and an NMOS transistor formed in the P well,

in the standard cell rows of each of the first and second circuit block, positions of the N well and the P well in the vertical direction are switched every other row, the first and second standard cell rows share the N well, and the second and third standard cell rows share the P well,

a height in the vertical direction of the standard cell in the second circuit block is greater than a height in the vertical direction of the standard cell in the first circuit block,

in at least one of the standard cell rows in the second circuit block, a distance from an NMOS transistor located at least one end thereof to an end closer to the NMOS transistor in the horizontal direction of the P well is greater than or equal to a width in the vertical direction of the P well shared by the second and third standard cell rows in the first circuit block.

24. A semiconductor integrated circuit device comprising:

a circuit block including a plurality of standard cell rows arranged in a vertical direction, each standard cell row including standard cells arranged in a horizontal direction,

wherein each of the standard cell rows includes an N well and a P well extending in the horizontal direction and adjacent to each other in the vertical direction,

each of the standard cells has a PMOS transistor formed in the N well and an NMOS transistor formed in the P well,

in the standard cell rows, positions of the N well and the P well in the vertical direction are switched every other row, the first and second standard cell rows share the N well, and the second and third standard cell rows share the P well,

a width in the vertical direction of the P well in the first standard cell row is greater than or equal to a shared-P well width which is a width in the vertical direction of the P well shared by the second and third standard cell rows, and

each of the standard cells has a width in the vertical direction of the P well greater than or equal to the shared-P well width.

25. A semiconductor integrated circuit device comprising:

a circuit block including a plurality of standard cell rows arranged in a vertical direction, each standard cell row including standard cells arranged in a horizontal direction,

wherein each of the standard cell rows includes an N well and a P well extending in the horizontal direction and adjacent to each other in the vertical direction,

each of the standard cells has a PMOS transistor formed in the N well and an NMOS transistor formed in the P well,

in the standard cell rows, positions of the N well and the P well in the vertical direction are switched every other row, the first and second standard cell rows share the N well, and the second and third standard cell rows share the P well,

a dummy cell row having dummy cells arranged in the horizontal direction, each dummy cell having a P well, is arranged closer to the outside than the first standard cell row with the P well being shared with the dummy cell row and the first standard cell row, and

a width in the vertical direction of the P well shared by the first standard cell row and the dummy cell row is greater than or equal to a shared-P well width which is a width in the vertical direction of the P well shared by the second and third standard cell rows.

26. The semiconductor integrated circuit device of claim 25 , wherein

the dummy cell is a standard cell which does not share an input/output with any other standard cells.

27. The semiconductor integrated circuit device of claim 25 , wherein

the dummy cell includes an inter-powerline capacitance element, a diode element, a dummy gate which is not connected to any other elements, or a dummy wire which is not connected to any other elements.

28. The semiconductor integrated circuit device of claim 25 , wherein

the dummy cell does not have an N well.

29. A semiconductor integrated circuit device comprising:

a circuit block including a plurality of standard cell rows arranged in a vertical direction, each standard cell row including standard cells arranged in a horizontal direction,

wherein each of the standard cell rows includes an N well and a P well extending in the horizontal direction and adjacent to each other in the vertical direction,

the N well and the P well possessed by each of the standard cell rows are formed on a triple well which is an N well,

each of the standard cells has a PMOS transistor formed in the N well and an NMOS transistor formed in the P well,

in the standard cell rows, positions of the N well and the P well in the vertical direction are switched every other row, the first and second standard cell rows share the P well, and the second and third standard cell rows share the N well, and

a width in the vertical direction of an N well which is a combination of the N well of the first standard cell row and the triple-well formed outside the N well of the first standard cell row is greater than or equal to a width in the vertical direction of the N well shared by the second and third standard cell rows.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 25, 2015
From: PANASONIC CORPORATION
To: SOCIONEXT INC.
Reel/Frame 035294/0942 →
CHANGE OF NAME Recorded Nov 21, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0570 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 16, 2008
From: KONDO, HIDEAKI; MORIWAKI, TOSHIYUKI; TAMARU, MASAKI; ANDOH, TAKASHI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 021101/0453 →