Semiconductor package having integrated antenna pad
An apparatus for a semiconductor-package includes a semiconductor device having a radio frequency (RF) input or output, an antenna pad, and a package structured to house the semiconductor device and the antenna pad. The antenna pad may be coupled to the radio frequency (RF) input or output, and the antenna pad is structured to reduce the inductance of the package. The antenna pad may include a pad disposed above the semiconductor device, a pad disposed to a side of the semiconductor device, or an antenna chip. An antenna may be coupled to the antenna pad. The antenna may include a trace antenna, a staggered antenna, or a helical antenna.
1. An integrated circuit package, comprising:
an integrated circuit substrate;
a semiconductor device having a radio frequency (RF) circuit mounted on the integrated circuit substrate;
a compound disposed on the integrated circuit substrate and encapsulating the semiconductor device;
an antenna connection pad mounted on the integrated circuit substrate, wherein the semiconductor device is electrically coupled to both the antenna connection pad; and
an antenna connected to the antenna connection pad and incorporated directly on the integrated circuit substrate, wherein the antenna is electrically coupled to at least one integrated circuit pin that is external to the encapsulating compound at an exterior of the integrated circuit package.
2. The package of claim 1 wherein the antenna comprises a two-dimensional antenna.
3. The package of claim 1 wherein the antenna comprises a three-dimensional antenna.
4. The package of claim 1 , wherein the antenna connection pad is disposed above the semiconductor device.
5. The package of claim 1 , wherein the antenna connection pad is disposed adjacent to the semiconductor device.
6. The package of claim 1 ,
wherein the compound does not cover the antenna connection pad.
7. The package of claim 6 , further comprising a protective coating covering the antenna connection pad.
8. The package of claim 6 , wherein the antenna connection pad is disposed above the compound.
9. The package of claim 1 wherein the antenna is disposed about the periphery of the RF circuit.
10. A semiconductor package, comprising:
a package substrate;
a radio frequency circuit formed on a die having a connection pad, the die attached to the package substrate;
a compound disposed on the package substrate and, in conjunction with the package substrate, encapsulating the die;
at least one integrated circuit pin that is external to the compound at an exterior of the semiconductor package; and
an antenna formed directly on the package substrate and connected directly to the connection pad of the die and to the at least one integrated circuit pin external to the compound.
11. The package of claim 10 , further comprising a gold wire coupled between the connection pad and the antenna.
12. The package of claim 10 , further comprising at least one dielectric material surrounding the antenna.
13. The package of claim 10 , wherein the antenna is a loop antenna.
14. The package of claim 10 , wherein the compound covers the die and the antenna.
15. The package of claim 14 , wherein the compound comprises a mold compound.
16. The package of claim 14 , wherein the compound comprises a dielectric material.
17. A method of forming a surface mounted package, comprising:
forming an antenna directly on a package substrate;
mounting an integrated circuit component on the package substrate, the integrated circuit including a connection pad;
covering the integrated circuit and antenna with an encapsulant disposed on the package substrate;
connecting the antenna directly to the connection pad; and
electrically connecting the antenna to at least one integrated circuit pin that is external to the encapsulant at an exterior of the surface mounted package.
18. The method of claim 17 , wherein forming an antenna comprises forming a trace antenna.
19. The method of claim 17 , wherein forming an antenna comprises forming an antenna pad.
20. The method of claim 17 , wherein connecting the antenna directly to the connection pad comprises attaching a wire connection to the antenna and to the connection pad.
21. The method of claim 17 , further comprising forming connection pins on the package substrate.
22. The method of claim 17 wherein forming the antenna includes forming the antenna integral with the package substrate.
23. The method of claim 17 wherein forming the antenna includes disposing the antenna about the periphery of the IC component.
24. The method of claim 17 further comprising matching an impedance of antenna with atmospheric impedance.