IP Library Patent Application 12065933
Patent Application
App. No. 12/065,933

Micro-Electro-Mechanical System (Mems) Capacitor Microphone and Method of Manufacturing Thereof

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Patent No.
US None
App. No.
12/065,933
Abstract

The invention relates to a method of manufacturing a MEMS capacitor microphone and further to such MEMS capacitor microphone. With the method a MEMS capacitor microphone can be manufactured by stacking pre-processed foils ( 10 ) having a conductive layer ( 11 a, 11 b ) on at least one side. After stacking, the foils ( 10 ) are sealed, using pressure and heat. Finally the MEMS capacitor microphones are separated from the stack (S). The pre-processing of the foils (preferably done by means of a laser beam) comprises a selection of the following steps: (A) leaving the foil intact, (B) locally removing the conductive layer, (C) removing the conductive layer and partially evaporating the foil ( 10 ), and (D) removing both the conductive layer as well as foil ( 10 ), thus making holes in the foil ( 10 ). In combination with said stacking, it is possible to create cavities and membranes. This opens up the possibility of manufacturing MEMS capacitor microphone.

Claims (29)

1 . A method of manufacturing a Micro-Electro-Mechanical System (MEMS) capacitor microphone provided with a space, which method comprises the following steps:

providing a set of at least two electrically insulating flexible foils, wherein a conductive layer is present on at least one side of at least one foil, and wherein said conductive layer is suitable for use as an electrode or a conductor;

patterning the conductive layer so as to form an electrode or a conductor;

patterning at least one foil, in such a manner that an opening is formed, which opening forms the space of the MEMS capacitor microphone;

stacking the set of foils, thus forming the MEMS capacitor microphone; and

joining the foils together, with the foils being bonded together at those positions where, when two adjacent foils are in contact with each other, at least one conductive layer between the foil material of two adjacent foils has been removed.

2 . A method as claimed in claim 1 , characterized in that a set of foils is provided, with the individual foils comprise the same type of foil material.

3 . A method as claimed in claim 1 , characterized in that a set of foils is provided, with the individual foils having substantially the same thickness.

4 . A method as claimed in claim 1 , characterized in that at least three electrically insulating flexible foils are provided.

5 . A method as claimed in claim 1 comprising the additional steps of:

patterning a first flexible foil in a way that a membrane is formed covering one side of at least one opening;

patterning a second flexible foil in a way that there is at least one hole in the second flexible foil being in contact with the opening.

6 . A method as claimed in claim 1 , characterized in that said patterning is carried out by means of a laser, whether or not in combination with a masks.

7 . A method as claimed in claim 1 , characterized in that said stacking of the foils takes place by winding at least one foil onto a first reel.

8 . A method as claimed in claim 7 , characterized in that the method is carried out in a process in which the foil is unwound from a second reel or roll upon being wound onto the first reel.

9 . A method as claimed in claim 1 , characterized in that said joining of the foils is carried out by exerting a pressure on the stacked foils at an elevated temperature, with the pressure being exerted in a direction perpendicular to the foils.

10 . A method as claimed in claim 9 , characterized in that the required pressure on the foils adjacent to the space in the structure is obtained through the application of an elevated pressure in said space.

11 . A method as claimed in claim 1 , characterized in that the MEMS capacitor microphone is individualized from the stack after fusion of the foils has taken place.

12 . A method as claimed in claim 1 , characterized in that the foil material is selected from the group consisting of polyphenyl sulphide and polyethylene terephthalate.

13 . A method as claimed in claim 1 , characterized in that the foil that is used has a thickness between 1 μm and 5 μm.

14 . Micro-Electro-Mechanical System (MEMS) capacitor microphone comprising a stacked set of at least two electrically insulating flexible foils, wherein a patterned conductive layer is present on at least one side of at least one foil, and wherein said conductive layer is suitable for use as an electrode or a conductor; at least one foil is patterned in such a manner that an opening is formed, which opening forms the space of the MEMS capacitor microphone; and the foils are bonded together at those positions where, when two adjacent foils are in contact with each other, at least one conductive layer between the foil material of two adjacent foils has been removed.

15 . A MEMS capacitor microphone as claimed in claim 14 , characterized in that the set of foils comprises at least three foils, with a space being present in the microsystem, which space is provided on a first side thereof with a first foil arranged as a membrane for absorbing sound waves, and which space is provided on a second side thereof with a second foil arranged as a backplate, which second foil comprises an opening for the passage of pressure waves to a free space, which space has a thickness, measured in a direction perpendicular to the foils, of at least one foil, and in that the microsystem is further characterized in that the membrane and the backplate are also provided with a conductive layer, which layers lead to areas for electrically connecting the microsystem.

16 . A MEMS capacitor microphone as claimed in claim 14 comprising an opening in the stack of foils so as to provide access from one side of the MEMS capacitor microphone to a conductive layer that is connected to an electrode of the MEMS capacitor microphone.

17 . A stack of electrically insulating flexible foils comprising the MEMS capacitor microphone as claimed in claim 14 .

18 . An electronic device comprising the MEMS capacitor microphone as claimed in claim 14 .

19 . An electronic device comprising the stack of electrically insulating flexible foils comprising the MEMS capacitor microphone as claimed in claim 17 .

20 . An electronic device as claimed in claim 18 , characterized in that said electronic device furthermore comprises an integrated circuit for reading or driving a signal from the MEMS capacitor microphone.

21 . An electronic device as claimed in claim 20 , characterized in that the MEMS capacitor microphone is provided with a recess, in which the integrated circuit is accommodated, so that the MEMS capacitor microphone in fact forms part of the package of the integrated circuit, which integrated circuit is connected to the MEMS capacitor microphone.

22 . Use of the electronic device as claimed in claim 19 , characterized in that the MEMS capacitor microphone delivers a voltage X on electrodes for recording sound and wherein the voltage X is read by the integrated circuit.

Assignments (12)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 28, 2011
From: NXP B.V.
To: KNOWLES ELECTRONICS ASIA PTE. LTD.
Reel/Frame 026665/0310 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 6, 2008
From: LANGEREIS, GEERT; WEEKAMP, JOHANNES WILHELMUS; GIESBERS, JACOBUS BERNARDUS
To: NXP B.V.
Reel/Frame 020608/0101 →