Electronic circuit device and method for manufacturing same
View Patent ↗An electronic circuit device includes at least one semiconductor element, a plurality of external connection terminals, connecting conductors electrically connecting the semiconductor element and external connection terminals, and an insulating resin covering the semiconductor element and supporting the connecting conductors integrally. The semiconductor element is buried in the insulating resin, and terminal surfaces of the external connection terminals are exposed from the insulating resin.
1. A manufacturing method of an electronic circuit device, comprising:
setting a positioning plate having an element accommodating region for accommodating a semiconductor element, and a terminal accommodating region formed in a deeper step than the element accommodating region, for accommodating a plurality of external connection terminals;
arranging the semiconductor element in the element accommodating region in a direction for exposing electrode pads of the semiconductor element, and arranging the external connection terminals in the terminal accommodating region;
connecting the semiconductor element and the external connection terminals electrically by connecting conductors;
a first resin molding step of covering and molding the connecting conductors, the semiconductor element and exposed sides of the external connection terminals with an insulating resin; and
a second resin molding step of covering and molding regions of the external connection terminals contacting with the terminal accommodating region except for their terminal surfaces, and a region excluding a surface of the semiconductor element contacting with the element accommodating region, with an insulating resin, burying the semiconductor element in the insulating resin, integrating the semiconductor element and the external connection terminals, and exposing the terminal surfaces.
2. The manufacturing method of the electronic circuit device of claim 1 ,
wherein the setting a positioning plate further includes forming a component accommodating region shallower than the terminal accommodating region in the positioning plate,
the arranging the semiconductor element further includes disposing a passive component in the component accommodating region,
the connecting the semiconductor element further includes connecting the passive component to the semiconductor element and at least one of the external connection terminals by the connecting conductors, and
the first resin molding step and the second resin molding step further include burying the passive component, as well as the semiconductor element, into the insulating resin.
3. The manufacturing method of the electronic circuit device of claim 1 ,
wherein the positioning plate is used as a lower in at the first resin molding step.
4. The manufacturing method of the electronic circuit device of claim 1 ,
wherein thin metal wires are used as the connecting conductors.
5. The manufacturing method of the electronic circuit device of claim 1 ,
wherein as each of the connecting conductors, a wiring conductor having a wiring pattern for connecting to the semiconductor element and a connection region for connecting to one of the external connection terminals is supported by an insulating sheet.
6. The manufacturing method of the electronic circuit device of claim 1 ,
wherein in the arranging the semiconductor element, a first semiconductor element in the element accommodating region and one or more second semiconductor elements in a region enclosed by electrode pads of the first semiconductor element are accumulated and disposed.