Method and device for placing thin material layers onto a relief mould
View Patent ↗The present invention relates to a method and a device for placing at least one material layer onto a relief mold for producing a composite material. Thereby, an elastically-reversibly deformable body with a surface relief that is designed to correspond to the relief mold is pressed against the material layer, as a result of which the surface of said body is deformed, and the material layer can be picked up. As a result of its elastically-reversible characteristics the body subsequently deforms back to its initial state so that the material layer can easily be placed onto the relief mold.
1. A method for placing at least one material layer onto a relief mould for producing composite materials, the method comprising:
building up a pressure force by pressing an elastically-reversibly deformable body onto the material layer deposited on a placement area, wherein the body is made of a foam material which is able to automatically relax the body from a deformed state of the body to a non-deformed state of the body, wherein a surface of the body in the non-deformed state comprises a surface relief that corresponds to the relief mould, wherein the surface relief elastically deforms by the pressure force so that the surface of the body rests flat against the material layer;
generating a retention force on the material layer by a suction stream, which temporarily fixes the material layer to the surface;
reducing the pressure force by lifting the surface from the placement area, as a result of which the surface automatically relaxes to its non-deformed state and in so doing imparts to the material layer a surface relief that corresponds to the relief mould;
arranging the body together with the material layer that has been fixed to its surface opposite the relief mould so that the surface relief of the material layer correspondingly matches the relief mould; and
placing the material layer onto the relief mould by cancelling the retention force.