IP Library Granted Patent US 7,532,484
Granted Patent B1
US 7,532,484 · App. 12/069,469 · Granted May 12, 2009

Electronic component assembly

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Quick Facts
Patent No.
US 7,532,484
App. No.
12/069,469
Granted
May 12, 2009
Kind
B1
Abstract

An electronic component assembly includes an electrical component assembled to a base and mounted to a support. The component electrical leads protrude through holes, along a channel, and make contact with connectors on the base. The base is formed of a polymeric material and contains protrusions for mechanically supporting the electrical component. When the base is mounted to the support, the connectors complete the electrical connection between the electrical component and the support.

Claims (21)

1. An electronic component assembly comprising:

a base formed of a electrically insulative material comprising a first side and a second side, said base comprising a hole extending from the first side to the second side and an electrical connector at said second side outboard said hole, said base further comprising a channel formed in second side of the base extending between the hole and the electrical connector; and

an electronic component assembled to the base adjacent the first side, said electronic component comprising a lead extending through the hole and having a portion received within the channel extending in contact with the electrical connector.

2. The electronic component assembly in accordance with claim 1 , wherein said electrical connector is a bushing embedded within the base and having a bore adapted to receive a terminal.

3. The electronic component assembly in accordance with claim 1 , wherein said electrical connector is a pin protruding from the base, said pin being adapted to be received within a bushing in a support.

4. The electronic component assembly in accordance with claim 1 , wherein said base comprises means for attaching the electrical component to the base.

5. The electronic component assembly in accordance with claim 4 , wherein said means comprises one or more protrusions extending from the first side and engaging a sidewall of the electrical component.

6. An electronic component assembly comprising:

a base formed of a polymeric material, said base comprising a first side and a second side, said base comprising a first hole extending from the first side to the second side, a first metal bushing outboard the first hole, and a first channel formed in the second side extending between the first hole and the first metal bushing, said base further comprising a second hole extending from the first side to the second side, a second metal bushing outboard the second hole, and a second channel formed in the second side extending between the second hole and the second metal bushing;

an electronic component assembled to the base and comprising an end face abutting the first side of the base, said electronic component comprising a first lead extending from the end face through the first hole and having a portion received within the first channel extending into contact with the first metal bushing, said electronic component comprising a second lead extending from the end face through the second hole and having a portion received within the second channel extending to the second metal bushing; and

a support, said base being mounted to the support such that the second side is adjacent the support, said support comprising a first terminal received in the first metal bushing and a second terminal received in the second metal bushing.

7. The electronic component assembly in accordance with claim 6 , wherein said component comprises a sidewall extending from the end face, said base further comprising a protrusion extending from the first side and engaging the sidewall to hold the electronic component to the base.

8. The electronic component assembly in accordance with claim 7 , wherein the protrusion comprises one or more segments that are circumferentially spaced.

9. The electronic component assembly in accordance with claim 6 , wherein the first metal bushing and the second metal bushing are outboard the protrusion.

10. An electronic component assembly comprising:

a base formed of a polymeric material, said base comprising a first side and a second side, said base comprising a first hole extending from the first side to the second side, a first metal pin outboard the first hole, and a first channel formed in the second side extending between the first hole and the first metal pin, said base further comprising a second hole extending from the first side to the second side, a second metal pin outboard the second hole, and a second channel formed in the second side extending between the second hole and the second metal pin;

an electronic component assembled to the base and comprising an end face abutting the first side of the base, said electronic component comprising a first lead extending from the end face through the first hole and having a portion received within the first channel extending into contact with the first metal pin, said electronic component comprising a second lead extending from the end face through the second hole and having a portion received within the second channel extending to the second metal pin; and

a support, said base being mounted to the support such that the second side is adjacent the support, said support comprising a first metal bushing adapted to receive the first metal pin and a second metal bushing adapted to receive the second metal pin.

11. The electronic component assembly in accordance with claim 10 , wherein said component comprises a sidewall extending from the end face, said base further comprising a protrusion extending from the first side and engaging the sidewall to hold the electronic component to the base.

12. The electronic component assembly in accordance with claim 11 , wherein the protrusion comprises one or more segments that are circumferentially spaced.

13. The electronic component assembly in accordance with claim 10 , wherein the first metal pin and the second metal pin are outboard the protrusion.

Assignments (7)
CHANGE OF NAME Recorded Sep 18, 2024
From: DELPHI TECHNOLOGIES IP LIMITED
To: BORGWARNER US TECHNOLOGIES LLC
Reel/Frame 068985/0968 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2018
From: DELPHI TECHNOLOGIES, INC
To: DELPHI TECHNOLOGIES IP LIMITED
Reel/Frame 045113/0958 →
RELEASE OF SECURITY INTEREST Recorded Jan 14, 2015
From: JPMORGAN CHASE BANK, N.A.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 034762/0540 →
SECURITY AGREEMENT Recorded Apr 18, 2011
From: DELPHI TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 026146/0173 →
RELEASE OF SECURITY INTEREST Recorded Apr 15, 2011
From: THE BANK OF NEW YORK MELLON
To: DELPHI CONNECTION SYSTEMS HOLDINGS LLC; DELPHI PROPERTIES MANAGEMENT LLC; DELPHI TECHNOLOGIES, INC.; DELPHI AUTOMOTIVE SYSTEMS LLC; DELPHI CONNECTION SYSTEMS LLC; DELPHI CORPORATION; DELPHI HOLDINGS LLC; DELPHI INTERNATIONAL SERVICES COMPANY LLC; DELPHI MEDICAL SYSTEMS LLC; DELPHI TRADE MANAGEMENT LLC
Reel/Frame 026138/0574 →
SECURITY AGREEMENT Recorded Nov 13, 2009
From: DELPHI TECHNOLOGIES, INC.
To: BANK OF NEW YORK MELLON, AS ADMINISTRATIVE AGENT, THE
Reel/Frame 023510/0562 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2008
From: SAILOR, STEVEN L.; HUNKELER, HUGH R.; HINZE, LEE R.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 020561/0143 →