IP Library Granted Patent US 7,808,762
Granted Patent B2
US 7,808,762 · App. 12/071,037 · Granted Oct 5, 2010

Semiconductor device performing overheat protection efficiently

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Quick Facts
Patent No.
US 7,808,762
App. No.
12/071,037
Granted
Oct 5, 2010
Kind
B2
Abstract

A semiconductor device includes a constant voltage circuit configured to convert an input voltage to a predetermined voltage by controlling an output transistor, and an overheat protection circuit configured to restrict output current of the constant voltage circuit according to temperature of the semiconductor device. The overheat protection circuit includes a diode to detect the temperature of the semiconductor device and a resistor connected in series with the diode.

Claims (21)

1. A semiconductor device comprising:

a constant voltage circuit configured to convert an input voltage to a predetermined voltage by controlling an output transistor; and

an overheat protection circuit configured to restrict output current of the constant voltage circuit in accordance with temperature of the semiconductor device,

the overheat protection circuit including:

a diode to detect the temperature of the semiconductor device;

a resistor connected in series with the diode;

a reference voltage line; and

a comparator for comparing a potential at an anode of the diode to a potential on the reference voltage line, and if the potential at the anode is greater than the potential on the reference voltage line then controlling the output transistor to stay on, and if the potential at the anode is less than the potential on the reference voltage line then controlling the output transistor to turn off, wherein the comparator outputs a signal at a low level when the potential at the anode is greater than the potential on the reference voltage line and the comparator outputs a signal at a high level when the potential at the anode is less than the potential on the reference voltage line, and wherein the resistor is formed on the semiconductor device between an N+ region that is a cathode electrode of the diode and a P+ region that is connected to ground.

2. The semiconductor device according to claim 1 , wherein the diode is positioned close to the output transistor.

3. The semiconductor device of claim 1 , wherein the comparator outputs a signal at a high level shutting off an output current when the potential at the anode is less than the potential on the reference voltage line.

4. A semiconductor device comprising:

a constant voltage circuit configured to convert an input voltage to a predetermined voltage by controlling an output transistor; and

an overheat protection circuit configured to restrict output current of the constant voltage circuit in accordance with temperature of the semiconductor device,

the overheat protection circuit including:

a diode to detect the temperature of the semiconductor device;

a resistor provided between the diode and ground;

a constant current source supplying current to the diode and the resistor;

a reference voltage line; and

a comparator for comparing a potential at an anode of the diode to a potential on the reference voltage line, wherein the comparator outputs a signal at a low level when the potential at the anode is greater than the potential at the reference voltage line to control the output transistor to stay on, and the comparator outputs a signal at a high level when the potential at the anode is less than the potential on the reference voltage line to control the output transistor to turn off, and wherein the resistor is formed on the semiconductor device between an N+ region that is a cathode electrode of the diode and a P+ region that is connected to ground.

5. The semiconductor device according to claim 4 , wherein the diode is positioned close to the output transistor.

6. The semiconductor device of claim 4 , wherein the comparator outputs a signal at a high level shutting off an output current when the potential at the anode of the diode is less than the reference voltage.

Assignments (4)
CHANGE OF NAME Recorded Mar 3, 2022
From: NEW JAPAN RADIO CO., LTD.
To: NISSHINBO MICRO DEVICES INC.
Reel/Frame 059311/0446 →
MERGER Recorded Feb 14, 2022
From: RICOH ELECTRONIC DEVICES CO., LTD.
To: NEW JAPAN RADIO CO., LTD.
Reel/Frame 059085/0740 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 18, 2015
From: RICOH COMPANY, LTD.
To: RICOH ELECTRONIC DEVICES CO., LTD.
Reel/Frame 035011/0219 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 14, 2008
From: INOUE, KOHSUKE
To: RICOH COMPANY, LTD.
Reel/Frame 020565/0687 →