Electronic instrument including a coil unit
A coil unit includes a planar coil, a magnetic member that is provided under the planar coil, a magnetic flux leakage prevention member that is provided under the magnetic member, and a heat sink that is provided under the magnetic flux leakage prevention member. The magnetic flux leakage prevention member is electrically insulated from the heat sink. The magnetic flux leakage prevention member is insulated from the heat sink using a double-sided adhesive tape, for example. Since the heat sink dissipates heat generated from the planar coil and is electrically insulated from the magnetic flux leakage prevention member, the heat sink does not function as a member which receives a magnetic flux.
1. An electronic instrument comprising:
a coil unit, the coil unit comprising:
a planar coil;
a magnetic member that increases an inductance of the planar coil;
a magnetic flux leakage prevention member that absorbs a magnetic flux leaking from the magnetic member;
heat sink;
a printed circuit board having conductive patterns, the heat sink being provided on the printed circuit board and the conductive patterns being connected to the planar coil formed on the printed circuit board; and
at least one mounted component provided on the printed circuit board on a side that is provided with the heat sink, an upper side position of the planar coil being set to be higher than an upper side of a mounted component having a maximum height among the at least one mounted component,
the magnetic member being provided between the planer coil and the magnetic flux leakage prevention member,
the magnetic flux leakage prevention member being provided between the magnetic member and the heat sink, and
the magnetic flux leakage prevention member being electrically insulated from the heat sink; and
a casing that receives the coil unit,
the casing having a hole in a surface that faces the planar coil, the hole being covered with a protective cover;
the casing having a reinforcing section that is formed at a position that faces a maximum height position of the at least one mounted component, the reinforcing section having a thickness larger than that of the protective cover; and
when a height of an outer surface of the protective cover from the printed circuit board is referred to as H 1 , a maximum height of at least one mounted component with respect to the printed circuit board is referred to as H 2 , and a thickness of the reinforcing section is referred to as H 3 , H 1 >H 2 +H 3 being satisfied.
2. The electronic instrument of claim 1 , wherein the magnetic flux leakage prevention member is insulated from the heat sink through a double-sided adhesive tape.
3. The electronic instrument of claim 1 , wherein a mounted component among the at least one mounted component that has the maximum height is a capacitor that is connected to the planar coil.
4. The electronic instrument of claim 1 , the coil unit further includes a temperature detection element that detects a temperature of the heat sink, the temperature detection element being provided on a side of the printed circuit board opposite to a side that is provided with the heat sink.
5. The electronic instrument of claim 1 , the coil unit further includes an element that disconnects the planar coil from a power supply based on a temperature of the heat sink, the element being provided on a side of the printed circuit board opposite to a side that is provided with the heat sink.
6. The electronic instrument of claim 1 , wherein the printed circuit board has a positioning section that is guided through an assembly jig, the assembly jig receiving the heat sink, the magnetic flux leakage prevention member, the magnetic member, and the planar coil.
7. The electronic instrument of claim 1 , the coil unit further including a spacer member that is disposed on an upper side of the magnetic member,
the spacer member including a hole that receives the planar coil, an upper side of the planar coil being substantially flush with an upper side of the spacer member.
8. The electronic instrument of claim 1 , wherein the magnetic flux leakage prevention member and the heat sink have a substantially identical planar size, and the heat sink has a thickness larger than that of the magnetic flux leakage prevention member.