Method of manufacturing semiconductor element
View Patent ↗A method of manufacturing a semiconductor element includes implanting ions of a dopant having a large diffusion coefficient into a semiconductor to provide a doped layer; and irradiating the doped layer with a plurality of pulsed laser beams supplied by a plurality of laser irradiation devices to activate the doped layer and provide an activated doped layer. The activated doped layer may be one of a single doped layer or a plurality of successive doped layers which each have respective conduction types that are one of identical or different. Device breakage and failure of the manufactured semiconductor element due to heat induced during laser irradiation are substantially prevented by this method.
1. A method of manufacturing a semiconductor element, comprising:
implanting ions of a dopant having a large diffusion coefficient into a semiconductor to provide a doped layer; and
irradiating the doped layer with a plurality of pulsed laser beams, and with at least one continuous laser beam, supplied by a plurality of laser irradiation devices to activate the doped layer and provide an activated doped layer that is one of a single doped layer or a plurality of successive doped layers which each have respective conduction types that are one of identical or different.
2. The method of manufacturing a semiconductor element according to claim 1 , wherein the dopant is at least one material selected from the group consisting of lithium, sulfur, selenium, and hydrogen.
3. The method of manufacturing a semiconductor element claim 2 , wherein the semiconductor is a wafer, and wherein the method further comprises, prior to irradiating, affixing the wafer to a stage of an electrostatic chuck during laser irradiation.
4. The method of manufacturing a semiconductor element claim 1 , wherein the semiconductor is a wafer, and wherein the method further comprises, prior to irradiating, affixing the wafer to a stage of an electrostatic chuck during laser irradiation.
5. A method of manufacturing a semiconductor element, comprising:
implanting ions of a dopant having a large diffusion coefficient into a semiconductor to provide a doped layer; and
irradiating the doped layer with laser beams (a) from one of a pulsed solid-state laser or a pulsed excimer laser, and (b) from a continuous semiconductor laser to activate the doped layer and provide an activated doped layer that is one of a single doped layer or a plurality of successive doped layers which each have respective conduction types that are one of identical or different.
6. The method of manufacturing a semiconductor element according to claim 1 , wherein irradiating the doped layer with laser beams is accomplished (a) with said plurality of pulsed laser beams from one of a solid-state laser and an excimer laser and (b) with said continuous laser beam from a semiconductor laser.
7. The method of manufacturing a semiconductor element according to claim 6 , wherein the semiconductor is a wafer, and wherein the continuous laser beam from the semiconductor laser irradiates a surface of the wafer in its entirety.
8. The method of manufacturing a semiconductor element according to claim 7 , wherein the dopant is at least one material selected from the group consisting of lithium, sulfur, selenium, and hydrogen.
9. The method of manufacturing a semiconductor element according to claim 8 , wherein the method further comprises, prior to irradiating, affixing the wafer to a stage of an electrostatic chuck during laser irradiation.
10. The method of manufacturing a semiconductor element according to claim 7 , wherein the method further comprises, prior to irradiating, affixing the wafer to a stage of an electrostatic chuck during laser irradiation.
11. The method of manufacturing a semiconductor element according to claim 6 , wherein the dopant is at least one material selected from the group consisting of lithium, sulfur, selenium, and hydrogen.
12. The method of manufacturing a semiconductor element according to claim 11 , wherein the semiconductor is a wafer, and wherein the method further comprises, prior to irradiating, affixing the wafer to a stage of an electrostatic chuck during laser irradiation.
13. The method of manufacturing a semiconductor element according to claim 6 , wherein the semiconductor is a wafer, and wherein the method further comprises, prior to irradiating, affixing the wafer to a stage of an electrostatic chuck during laser irradiation.
14. The method of manufacturing a semiconductor element according to claim 5 , wherein the dopant is at least one material selected from the group consisting of lithium, sulfur, selenium, and hydrogen.
15. The method of manufacturing a semiconductor element according to claim 14 , wherein the semiconductor is a wafer, and wherein the method further comprises, prior to irradiating, affixing the wafer to a stage of an electrostatic chuck during laser irradiation.
16. The method of manufacturing a semiconductor element according to claim 5 , wherein the semiconductor is a wafer, and wherein the method further comprises, prior to irradiating, affixing the wafer to a stage of an electrostatic chuck during laser irradiation.