IP Library Patent Application 12072732
Patent Application
App. No. 12/072,732

Printed circuit board module having two printed circuit boards for mounting inline package elements and adhibit elements respectively

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Quick Facts
Patent No.
US None
App. No.
12/072,732
Abstract

An exemplary printed circuit board (PCB) module ( 200 ) includes a first PCB ( 210 ); a second PCB electrically connected to the first PCB ( 230 ); a plurality of in-line package elements ( 220 ) provided on the first PCB and no surface-mounting elements provided thereon; and a plurality of surface-mounting elements ( 240 ) provided on the second PCB and no in-line package elements provided thereon.

Claims (32)

1 . A printed circuit board (PCB) module, comprising:

a first PCB;

a second PCB electrically connected to the first PCB;

a plurality of in-line package elements provided on the first PCB and no surface-mounting elements provided thereon; and

a plurality of surface-mounting elements provided on the second PCB and no in-line package provided thereon.

2 . The PCB module as claimed in claim 1 , further comprising a connector configured for electrically connecting the first PCB and the second PCB.

3 . The PCB module as claimed in claim 2 , wherein the connector comprises a socket arranged on the first PCB and a plug arranged at an edge of the second PCB.

4 . The PCB module as claimed in claim 3 , wherein the socket comprises a plurality of mating contact fingers within the interior of socket, the plug comprising a plurality of connecting fingers.

5 . The PCB module as claimed in claim 4 , wherein the first PCB comprises a first wiring layout formed thereon, connected to the mating contact fingers of the socket.

6 . The PCB module as claimed in claim 5 , wherein the first PCB further comprises a plurality of pin through holes, pins of the in-line package elements being received and welded in the pin through holes such that the in-line package elements being electrically connected to one another through the first wiring layout.

7 . The PCB module as claimed in claim 4 , wherein the second PCB comprises a second wiring layout formed thereon, connected to the connecting fingers of the plug.

8 . The PCB module as claimed in claim 7 , wherein the surface-mounting elements are connected to one another through the second wiring layout.

9 . The PCB module as claimed in claim 1 , wherein the surface-mounting elements are mounted on a surface of the second PCB by a surface mounted technology (SMT) device.

10 . The PCB module as claimed in claim 1 , wherein the in-line package elements can be dual in-line package elements or single in-line package element.

11 . A method for manufacturing the printed circuit board (PCB) module as claimed in claim 1 , comprising:

providing the first second PCB and the second PCB;

mounting the in-line package elements on the first PCB and mounting the surface-mounting elements on the second PCB respectively; and

realizing the first PCB electrically connecting the second PCB.

12 . The method as claimed in claim 11 , wherein the process of providing the first PCB comprises forming the first wiring layout and the pin throngh holes in the first PCB.

13 . The method as claimed in claim 12 , wherein the process of mounting the in-line package elements comprises inserting pins of the in-line package elements into the pin through holes of the first PCB, and welding the in-line package elements at a surface of the first PCB.

14 . The method as claimed in claim 11 , wherein the process of providing the second PCB comprises forming a second wiring layout in the second PCB.

15 . The method as claimed in claim 14 , wherein the process of mounting the surface-mounting elements comprises providing an integrated PCB including a plurality of the second PCBs to an SMT device, mounting the surface-mounting elements at a surface of the integrated PCB, and cutting off the integrated PCB to separate the plurality of the second PCBs.

16 . The method as claimed in claim 11 , wherein the surface-mounting elements are mounted at a surface of the second PCB by surface mounted technology (SMT).

17 . The method as claimed in claim 11 , wherein the first PCB and the second PCB are connected by a connector.

18 . A printed circuit board (PCB) module, comprising:

at least one in-line package elements;

at least one surface-mounting elements;

a first PCB for only mounting the in-line package element thereon; and

a second PCB for only mounting the surface-mounting element thereon;

wherein the first PCB is electrically connected to the second PCB.

19 . The PCB module as claimed in claim 1 , further comprising a connector configured for electrically connecting the first PCB and the second PCB.

20 . The PCB module as claimed in claim 2 , wherein the connector comprises a socket arranged on the first PCB and a plug arranged at an edge of the second PCB.

Assignments (3)
CHANGE OF NAME Recorded Apr 13, 2014
From: INNOLUX DISPLAY CORP.
To: CHIMEI INNOLUX CORPORATION
Reel/Frame 032672/0685 →
CHANGE OF NAME Recorded Apr 13, 2014
From: CHIMEI INNOLUX CORPORATION
To: INNOLUX CORPORATION
Reel/Frame 032672/0746 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 28, 2008
From: LU, JIAN-HUI
To: INNOCOM TECHNOLOGY (SCHENZHEN) CO., LTD.; INNOLUX DISPLAY CORP.
Reel/Frame 020626/0266 →