IP Library Granted Patent US 8,015,875
Granted Patent B2
US 8,015,875 · App. 12/073,199 · Granted Sep 13, 2011

Sensor device and method for fabricating sensor device

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Quick Facts
Patent No.
US 8,015,875
App. No.
12/073,199
Granted
Sep 13, 2011
Kind
B2
Abstract

The sensor device includes a dead-weight portion, a frame portion disposed so as to surround the dead-weight portion, a supporting portion provided at the frame portion via a first insulating layer, a mass portion provided at the dead-weight portion via a second insulating layer, a beam portion connecting the supporting and mass portions, a first concave portion, and a second concave portion, wherein a depth of the first or second concave portion is from 3.3% or more to 5.0% or less of the width of the frame portion.

Claims (11)

1. A sensor device, comprising:

a dead-weight portion and a frame portion disposed so as to surround the dead-weight portion;

a supporting portion provided at the frame portion via a first insulating layer;

a mass portion provided at the dead-weight portion via a second insulating layer;

a beam portion connecting the supporting portion and the mass portion;

a first concave portion partitioned by a face of the supporting portion facing an upper face of the frame portion, a face of the frame portion facing a bottom face of the supporting portion, and a side face of the first insulating layer at a side of the dead-weight portion;

a second concave portion partitioned by a face of the mass portion facing an upper face of the dead-weight portion, a face of the dead-weight portion facing a bottom face of the mass portion, and a side face of the second insulating layer at a side of the frame portion, wherein a depth of the first or second concave portion is 3.3% or more or 5.0% or less of a width of the frame portion; and

chamfered portions forming an angle of 40 to 60 degrees with the upper face of the frame portion and the upper face of the dead-weight portion at an edge of the upper face of the frame portion at the side of the dead-weight portion and at an edge of the upper face of the dead-weight portion.

2. The sensor device according to claim 1 , wherein a third concave portion is provided at the side face of the first insulating layer at the side of the dead-weight portion or at the side face of the second insulating layer at the side of the frame portion at a position corresponding to the beam portion.

3. The sensor device according to claim 1 , wherein the chamfered portions contact an edge of the first or second concave portion.

4. The sensor device according to claim 1 , further comprising a piezoresistance element around an end of the beam portion.

Assignments (3)
CHANGE OF NAME Recorded Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
CHANGE OF NAME Recorded Jan 22, 2009
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022162/0669 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 3, 2008
From: NOMURA, AKIHIKO
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 020634/0979 →