Method and apparatus to facilitate retention and removal of components placed on adhesive backed carrier tape for automated handling
View Patent ↗An improved adhesive-backed carrier tape system for packaging of components. Components or devices are held within the compartments of the carrier portion by a low tack adhesive level layer while a high tack adhesive layer is affixed to the carrier portion to provide means for high speed, low cost automated handling of the packaged components.
1. A carrier tape system for supplying components to a pick and place assembly machine through a feeder, comprising:
a. a carrier tape portion having a first surface which is an upper surface and a parallel spaced apart second surface which is a lower surface separated by a given thickness, the carrier tape portion having multiple compartments formed therein between the first and second, surface, each of the multiple compartments having openings including a first opening extending to and aligned with the first surface and a second opening extending to and aligned with the second surface, the respective openings aligned with the first surface permitting access to each respective compartment by the pick and place machine, the respective openings aligned with the second surface enabling an adhesive to retain a respective component;
b. at least one low tack adhesive layer;
c. at least one high tack adhesive layer; and
d. the at least one low tack adhesive layer positioned adjacent the second surface so that it is beneath the carrier tape and aligned with the multiple compartments to retain components respectively placed in the compartments and the at least one high tack adhesive layer affixed to the second surface of the carrier tape portion and positioned to secure the low tack adhesive layer to the carrier tape portion.
2. The carrier tape system of claim 1 further comprising:
a. the at least one low tack adhesive layer is applied to the second surface to form a low tack tape;
b. the at least one high tack adhesive layer is applied to the second surface to form a high tack tape; and
c. the low tack tape is positioned on top of the high tack tape to create a composite tape, the high tack tape having a greater width than the low tack tape such that the high tack is affixed to the second surface of the carrier portion and the low tack tape is aligned with the compartments.
3. The carrier tape system of claim 2 wherein the low tack tape is aligned with the compartments and the low tack tape has sufficient thickness to prevent the components which rest on the low tack adhesive layer to come into contact with the at least one high tack adhesive layer of the high tack tape.
4. The carrier tape system of claim 2 wherein at least one opening is placed into the low tack tape at a location where a component rests on the adhesive layer of the low tack tape to further reduce the adhesion of the component to the low tack adhesive layer.
5. A method of packaging components for automated handling, comprising:
a. providing a carrier tape portion having a first surface which is an upper surface and a parallel spaced apart second surface which is a lower surface separated by a given thickness, the carrier tape portion having multiple compartments formed therein between the first and second, surface, each of the multiple compartments having openings including a first opening extending to and aligned with the first surface and a second opening extending to and aligned with the second surface, the respective openings aligned with the first surface permitting access to each respective compartment by the pick and place machine, the respective openings aligned with the second surface enabling an adhesive to retain a respective component;
b. providing at least one low tack adhesive layer;
c. providing at least one high tack adhesive layer; and
d. the at least one low tack adhesive layer positioned adjacent the second surface so that it is beneath the carrier tape and aligned with the multiple compartments to retain components respectively placed in the compartments and the at least one high tack adhesive layer affixed to the second surface of the carrier tape portion and positioned to secure the low tack adhesive layer to the carrier tape portion.
6. The method of claim 5 further comprising:
a. applying the at least one low tack adhesive layer to the second surface to form a low tack tape;
b. applying the at least one high tack adhesive layer to the second surface to form a high tack tape; and
c. positioning the low tack tape on top of the high tack tape to create a composite tape, the high tack tape having a greater width than the low tack tape such that the high tack is affixed to the second surface of the carrier portion and the low tack tape is aligned with the compartments.
7. The method of claim 6 further comprising aligning the low tack tape so that it is aligned with the compartments and the low tack tape has sufficient thickness to prevent the components which rest on the low tack adhesive layer to come into contact with the at least one high tack adhesive layer of the high tack tape.
8. The method of claim 6 further comprising placing at least one opening into the low tack tape at a location where a component rests on the adhesive layer of the low tack tape to further reduce the adhesion of the component to the low tack adhesive layer.