Semiconductor device
A semiconductor device includes a resistor element formed in a semiconductor layer of an SOI substrate (Silicon On Insulator). The semiconductor device includes a low concentration impurity area formed in the semiconductor layer as the resistor element; a high concentration impurity area formed in the semiconductor layer as a resistor element wiring portion; and a silicide layer selectively formed on the high concentration impurity area. The high concentration impurity area includes one end portion contacting with an end portion of the low concentration impurity area, and the other end portion contacting with an impurity area of another element.
1 . A semiconductor device comprising:
an SOI (Silicon On Insulator) substrate having a semiconductor layer;
a low concentration impurity area formed in the semiconductor layer as a first resistor element;
a high concentration impurity area formed in the semiconductor layer as a resistor element wiring portion, said high concentration impurity area including one end portion contacting with an end portion of the low concentration impurity area and the other end portion contacting with an impurity area of another element; and
a silicide layer selectively formed on the high concentration impurity area.
2 . The semiconductor device according to claim 1 , further comprising an insulation film covering a surface of the SOI substrate.
3 . The semiconductor device according to claim 2 , further comprising a contact layer penetrating the insulation film for contacting the silicide layer.
4 . The semiconductor device according to claim 1 , further comprising a field-effect transistor formed in the semiconductor layer, said field-effect transistor including the high concentration impurity area.
5 . The semiconductor device according to claim 1 , further comprising a second resistor element formed in the semiconductor layer, said second resistor element including the high concentration impurity area.
6 . A semiconductor device comprising:
an SOI (Silicon On Insulator) substrate having a semiconductor layer;
a low concentration impurity area formed in the semiconductor layer as a resistor element;
a first high concentration impurity area formed in the semiconductor layer as a first resistor element wiring portion, said first high concentration impurity area contacting with a first end portion of the low concentration impurity area;
a second high concentration impurity area formed in the semiconductor layer as a second resistor element wiring portion, said second high concentration impurity area contacting with a second end portion of the low concentration impurity area; and
a gate electrode formed on the semiconductor layer for forming a depleted layer to divide the low concentration impurity area and at least one of the first high concentration impurity area and the second high concentration impurity area.
7 . The semiconductor device according to claim 6 , wherein said gate electrode includes a first gate electrode and a second gate electrode arranged alternately, said first gate electrode being adapted to form a first depleted layer for dividing the low concentration impurity area and the first high concentration impurity area, said second gate electrode being adapted to form a second depleted layer for dividing the low concentration impurity area and the second high concentration impurity area.
8 . The semiconductor device according to claim 6 , wherein said gate electrode includes a plurality of electrodes so that at least one of the electrodes is selected to form the depleted layer.