Laser mask and method of crystallization using the same
View Patent ↗Provided is a method for crystallizing using a laser mask for selectively crystallizing active regions without a laser shot mark, including: providing an array substrate in which N×M active regions are defined; positioning a laser mask having first and second blocks over the substrate, wherein the first and second blocks have first and second mask patterns, respectively, and the second mask pattern is a reverse pattern of the first mask pattern; irradiating a first laser beam onto the active regions through the first block; and irradiating a second laser beam onto the active regions through the second block.
1. A method of crystallization using a laser mask, comprising:
providing an array substrate in which N×M active regions are defined;
positioning a laser mask having first and second blocks, and a boundary region in the vicinity of the first and second blocks over the substrate,
wherein the first and second blocks have first and second mask patterns, respectively,
wherein the boundary region corresponds to the outside of the active regions to eliminate a shot mark and
wherein the second mask pattern is a reverse pattern of the first mask pattern;
irradiating a first laser beam onto the active regions through the first block; and
irradiating a second laser beam onto the active regions through the second block.
2. The method of claim 1 , wherein the first mask pattern includes a plurality of first transmitting regions and a plurality of first blocking regions excluding the first transmitting regions, and the second mask pattern includes a plurality of second blocking regions corresponding to the first transmitting regions and a plurality of second transmitting regions corresponding to the first blocking regions.
3. The method of claim 2 , wherein the first transmitting regions and the second blocking regions have the same shape, and the first blocking regions and the second transmitting regions have the same shape.
4. The method of claim 3 , wherein the transmitting regions and the blocking regions have a slit shape in a horizontal direction.
5. The method of claim 3 , wherein the transmitting regions and the blocking regions have a slit shape in a vertical direction.
6. The method of claim 1 , wherein the step of irradiating the second laser beam includes:
moving the laser mask or a stage on which the substrate is loaded in an X-axis or an Y-axis direction.
7. The method of claim 6 , further comprising:
repeating the crystallization to crystallize the entire N×M active regions.
8. The method of claim 6 , wherein the laser mask or the stage is moved by a size of each block.
9. The method of claim 1 , wherein the first and second laser beams have an energy density of a complete melting region.
10. The method of claim 1 , wherein the crystallization is a sequential lateral solidification.
11. The method of claim 1 , wherein the first mask pattern includes a plurality of first transmitting regions and a plurality of first blocking regions, and the second mask pattern includes a plurality of second blocking regions corresponding to the first transmitting regions and a plurality of second transmitting regions corresponding to the first blocking regions.