IP Library Granted Patent US 8,069,815
Granted Patent B2
US 8,069,815 · App. 12/076,384 · Granted Dec 6, 2011

Resist pipe and resist coating device

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Quick Facts
Patent No.
US 8,069,815
App. No.
12/076,384
Granted
Dec 6, 2011
Kind
B2
Abstract

A resist pipe and a resist coating device are provided. Support portions are provided at an inner wall of a resist supply portion towards a cross-sectional center of the resist supply portion from three locations. The support portions are provided at equal intervals at the inner wall, and the leading ends thereof extend to positions at which a circular rod-shaped liquid level sensor portion is nipped by a peripheral surface of the liquid level sensor portion. In this manner, the support portions support the liquid level sensor portion from three directions, and gaps are formed between the liquid level sensor portion and the inner wall of the resist supply portion. The liquid level sensor portion inside the resist supply portion is supported by the support portions such that a sensing portion is substantially in the same plane as an inlet aperture of the resist supply portion.

Claims (10)

1. A resist pipe, comprising:

a resist supply portion inserted into a container accommodating a resist liquid and configured to draw in the resist liquid, the resist supply portion having an inlet aperture and an inner wall; and

support portions provided at the inner wall of the resist supply portion, supporting a peripheral surface of a rod-shaped liquid level sensor portion from at least three directions, and setting a sensing portion at a leading end of the rod-shaped liquid level sensor portion in substantially the same plane as the inlet aperture, the support portions being provided at equal intervals at the inner wall of the resist supply portion, and gaps are formed between the rod-shaped liquid level sensor portion and the inner wall of the resist supply portion so as to ensure a space for the resist liquid to pass through.

2. A resist coating device comprising the resist pipe of claim 1 .

3. The resist pipe of claim 1 , wherein the inlet aperture is disposed at a bottom most location of the resist pipe.

4. The resist pipe of claim 1 , wherein the resist liquid enters into the resist pipe directly from the container via the inlet aperture.

5. The resist pipe of claim 1 , wherein the resist liquid is drawn out of the container via the gaps.

6. The resist pipe of claim 1 , wherein the rod-shaped liquid level sensor portion is solid.

7. The resist pipe of claim 1 , wherein the rod-shaped liquid level sensor portion is inserted into and disposed within the resist supply portion.

8. The resist pipe of claim 1 , wherein an end of the rod-shaped liquid level sensor portion that is inserted into the resist liquid is pointed.

Assignments (3)
CHANGE OF NAME Recorded Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
CHANGE OF NAME Recorded Jan 29, 2009
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022231/0935 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 18, 2008
From: MATSUKAWA, YOSHIHIKO
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 020716/0444 →