Semiconductor integrated circuit

1. A semiconductor integrated circuit having an internal circuit group which includes at least one internal circuit, comprising:

a plurality of process monitoring circuits, each of which is disposed at a different location in the internal circuit group, each of the process monitoring circuits, which is operated in response to a power supply voltage, detecting monitoring data in the area where one of the process monitoring circuits is disposed; and

a power supply voltage generating circuit generating the power supply voltage corresponding to the monitoring data, and supplying the power supply voltage to the internal circuit group;

wherein one of the process monitoring circuits includes a comparator circuit, which compares the monitoring data detected by itself in a current stage with the monitoring data in a previous stage of a serial transfer connection created by connecting each of the process monitoring circuits in succession, and

wherein the comparator circuit selects and transmits one of the monitoring data, which is higher, to a process monitoring circuit in a next stage of the serial transfer connection.

2. A semiconductor integrated circuit as claimed in claim 1

wherein each process monitoring circuit includes a delay circuit for delaying its input signal for a predetermined period.

3. A semiconductor integrated circuit as claimed in claim 2 , wherein at least one of the process monitoring circuits is disposed in a center area of the internal circuit group, and wherein at least one of the process monitoring circuits is disposed in a peripheral area of the internal circuit group.

4. A semiconductor integrated circuit as claimed in claim 3 , wherein each of the process monitoring circuits is disposed in one of sub-areas, which are formed by dividing an area where the internal circuit group is disposed, the monitoring data are detected in each sub-areas.

5. A semiconductor integrated circuit as claimed in claim 1 , further comprising:

a trimming logic circuit generating a trimming logic, which controls the power supply voltage,

wherein the power supply voltage generating circuit generates the power supply voltage, based on the trimming logic; and

wherein the trimming logic circuit includes a first route that a predetermined reference trimming logic is used as the trimming logic and a second route that new trimming logic is generated by correcting a trimming logic, which is generated by the monitoring data in a previous cycle.

6. A semiconductor integrated circuit as claimed in claim 5 , wherein the trimming logic circuit, which selects one of the monitoring data to make the power supply voltage be highest, includes a comparison circuit, which compares the selected monitoring data with reference data, wherein the trimming logic circuit determines the trimming logic corresponding to the comparison result performed by the comparison circuit, and wherein the trimming logic circuit holds the selected monitoring data as the reference data used for generating the timing logic at a next cycle.

7. A semiconductor integrated circuit as claimed in claim 5 , wherein each process monitoring circuit is directly connected to the trimming logic circuit and each process monitoring circuit supplies the monitoring data to the trimming logic circuit directly.

8. A semiconductor integrated circuit as claimed in claim 5 , wherein at least one of the process monitoring circuits is disposed in a center area of the internal circuit group, and wherein at least one of the process monitoring circuits is disposed in a peripheral area of the internal circuit group.

9. A semiconductor integrated circuit as claimed in claim 5 , wherein each of the process monitoring circuits is disposed in one of sub-areas, which are formed by dividing an area where the internal circuit group is disposed, the monitoring data are detected in each sub-areas.

10. A semiconductor integrated circuit as claimed in claim 1 , wherein at least one of the process monitoring circuits is disposed in a center area of the internal circuit group, and wherein at least one of the process monitoring circuits is disposed in a peripheral area of the internal circuit group.

11. A semiconductor integrated circuit as claimed in claim 1 , wherein each of the process monitoring circuits is disposed in one of sub-areas, which are formed by dividing an area where the internal circuit group is disposed, the monitoring data are detected in each sub-areas.