High heat-resistance resin composition and high heat-resistance insulated cable which uses the same
View Patent ↗A high heat-resistance resin composition, the high heat-resistance resin composition being thermally treated at 150° C. for 100 hours, wherein a heat absorption amount of the high heat-resistance resin composition which is measured at a melting point thereof by Differential Scanning Calorimetry (DSC) is equal to or less than 45 J/g before thermal treatment, an increasing rate of the heat absorption amount of the high heat-resistance resin composition which is measured at a melting point thereof after the thermal treatment by Differential Scanning Calorimetry (DSC) is equal to or less than 20% as compared to that before the thermal treatment, and a degree of extensibility thereof is equal to or more than 200% after the thermal treatment.
1. A high heat-resistance resin composition, comprising:
where the high heat-resistance resin composition is subject to a thermal treatment at 150° C. for 100 hours,
a heat absorption amount of the high heat-resistance resin composition which is measured at a melting point thereof by Differential Scanning Calorimetry (DSC) being equal to or less than 45 J/g before the thermal treatment;
an increasing rate of the heat absorption amount of the high heat-resistance resin composition which is measured at a melting point thereof after the thermal treatment by Differential Scanning Calorimetry (DSC) being equal to or less than 20% as compared to that before the thermal treatment; and
a degree of extensibility thereof being equal to or more than 200% after the thermal treatment,
wherein the high heat-resistance resin composition further comprises:
polyester resin;
PS-polyethylene/buthylene-PS triblock copolymer; and
polyolefin and/or a compound including glycidyl.
2. A high heat-resistance resin composition according to claim 1 , wherein
the polyester resin comprises polybutylene isophthalate.
3. A high heat-resistance resin composition according to claim 1 , wherein
the polyolefin comprises low-density polyethylene.
4. A high heat-resistance resin composition according to claim 1 , further comprising melamine cyanurate.
5. A high heat-resistance resin composition according to claim 1 , wherein
the high heat-resistance resin composition is used for an insulation of an insulated cable.
6. A high heat-resistance insulated cable, comprising:
a conductor; and
an insulation for insulating the conductor having a thickness of 0.1 mm to 0.5 mm,
the insulation comprising a high heat-resistance resin composition comprising:
where the high heat-resistance resin composition is subject to a thermal treatment at 150° C. for 100 hours,
a heat absorption amount of the high heat-resistance resin composition which is measured at a melting point thereof by Differential Scanning Calorimetry (DSC) being equal to or less than 45 J/g before the thermal treatment;
an increasing rate of the heat absorption amount of the high heat-resistance resin composition which is measured at a melting point thereof after the thermal treatment by Differential Scanning Calorimetry (DSC) being equal to or less than 20% as compared to that before the thermal treatment; and
a degree of extensibility thereof being equal to or more than 200% after the thermal treatment,
wherein the high heat-resistance resin composition further comprises:
polyester resin;
PS-polyethylene/buthylene-PS triblock copolymer; and
polyolefin and/or a compound including glycidyl.
7. A high heat-resistance resin composition, comprising:
where the high heat-resistance resin composition is subject to a thermal treatment at a predetermined temperature for a predetermined time,
a heat absorption amount of the high heat-resistance resin composition which is measured at a melting point thereof by Differential Scanning Calorimetry (DSC) being equal to or less than 45 J/g before the thermal treatment;
an increasing rate of the heat absorption amount of the high heat-resistance resin composition which is measured at a melting point thereof after the thermal treatment by Differential Scanning Calorimetry (DSC) being equal to or less than 20% as compared to that before the thermal treatment; and
a degree of extensibility thereof is equal to or more than 200% after the thermal treatment,
wherein the high heat-resistance resin composition further comprises:
polyester resin;
PS-polyethylene/buthylene-PS triblock copolymer; and
polyolefin and/or a compound including glycidyl.
8. A high heat-resistance resin composition according to claim 7 , wherein
the thermal treatment of the high heat-resistance resin composition is carried out at 140 to 160° C. for 90 to 110 hours.