Composite semiconductor device
The electrode of a thin-type capacitor is connected to the rear surface of a p-type semiconductor substrate which is brought to a ground potential, by a conductive DAF (Die Attach Film) or by a conductive adhesive, and the electrodes of the front surface of the p-type semiconductor substrate are respectively connected with and stacked on the terminals of a thin-type inductor by bumps, whereby manufacturing costs can be reduced while the occurrence of noise can be suppressed and packaging area can be made small.
1. A composite semiconductor device, comprising:
a thin-type capacitor having at least one electrode;
a conductive die-attach film (DAF);
a semiconductor substrate including:
a rear surface to be brought to a ground potential (GND) and that is secured to one electrode of the at least one electrode of the thin-type capacitor through the conductive die-attach film, and
a front side which is formed with elements and has an electrode provided on a surface thereof, and
a thin-type inductor having at least one terminal,
wherein one terminal of the at least one terminal of the thin-type inductor is secured by a bump to the electrode formed on the surface of the front side of the semiconductor substrate and another terminal of the at least one terminal of the thin-type inductor is connected to another electrode of the at least one electrode of the thin-type capacitor by wire bonding.
2. The composite semiconductor device as defined in claim 1 , wherein the semiconductor substrate has a conductivity type that is a p-type.
3. The composite semiconductor device as defined in claim 1 , further comprising a metal film formed on the rear surface of the semiconductor substrate, and the one electrode of the thin-type capacitor that is secured to the rear surface of the semiconductor substrate is secured through the metal film.
4. The composite semiconductor device as defined in claim 1 ,
wherein a metal film is formed on the rear surface of the semiconductor substrate and is connected by wire bonding to a GND terminal formed in the thin-type inductor.
5. The composite semiconductor device as defined in claim 4 , wherein the semiconductor substrate has a conductivity type that is a p-type.
6. The composite semiconductor device as defined in claim 4 , wherein the one electrode of the thin-type capacitor that is secured to the rear surface of the semiconductor substrate is secured through the metal film.
7. The composite semiconductor device as defined in claim 1 ,
wherein a metal film is formed on the rear surface of the semiconductor substrate and is connected to the electrode provided on the surface of the front side of the semiconductor substrate by a connection conductor which penetrates through the semiconductor substrate.
8. The composite semiconductor device as defined in claim 7 , wherein the semiconductor substrate has a conductivity type that is a p-type.
9. The composite semiconductor device as defined in claim 7 , wherein the one electrode of the thin-type capacitor that is secured to the rear surface of the semiconductor substrate is secured through the metal film.
10. The composite semiconductor device as defined in claim 1 , wherein the semiconductor substrate has a conductivity type that is a p-type.
11. The composite semiconductor device as defined in claim 1 , further comprising a metal film which is formed on the rear surface of the semiconductor substrate and which is connected to the electrode provided on the surface of the front side of the semiconductor substrate by a connection conductor which penetrates through the semiconductor substrate, wherein the one electrode of the thin-type capacitor that is secured to the rear surface of the semiconductor substrate is secured through the metal film.
12. A composite semiconductor device, comprising:
a thin-type capacitor having at least one electrode;
a conductive adhesive;
a semiconductor substrate that has including:
a rear surface to be brought to a ground potential (GND) and that is secured to one electrode of the at least one electrode of the thin-type capacitor through the conductive adhesive, and
a front side which is formed with elements and has an electrode provided on a surface thereof, and
a thin-type inductor having at least one terminal,
wherein one terminal of the at least one terminal of the thin-type inductor is secured by a bump to the electrode formed on the surface of the front side of the semiconductor substrate and another terminal of the at least one terminal of the thin-type inductor is connected to another electrode of the at least one electrode of the thin-type capacitor by wire bonding.
13. The composite semiconductor device as defined in claim 12 , wherein the conductive adhesive is a material selected from the group consisting of a silver paste and a solder.
14. The composite semiconductor device as defined in claim 13 , further comprising a metal film formed on the rear surface of the semiconductor substrate, wherein the one electrode of the at least one electrode of the thin-type capacitor that is secured to the rear surface of the semiconductor substrate is secured through the metal film.
15. The composite semiconductor device as defined in claim 12 , further comprising a metal film formed on the rear surface of the semiconductor substrate, wherein the one electrode of the at least one electrode of the thin-type capacitor that is secured to the rear surface of the semiconductor substrate is secured through the metal film.