Magnetic disk drive, wiring connection structure and terminal structure
View Patent ↗Terminals of a flexible printed circuit board and terminals of a wiring trace in a head suspension assembly are to be connected with each other by soldering without causing a soldering defect. In an embodiment, a terminal structure of a multi-connector in a wiring trace which includes an insulating layer and a conductor pattern portion formed on a surface of the insulating layer is provided with exposed portions of terminals exposed from apertures formed in part of the insulating layer and is also provided with lining portions adjacent to the exposed portions in a longitudinal direction of the conductor pattern portion and bonded to the insulating layer. Even if terminals of the multi-connector are cracked when soldered, not only conductivity is ensured, but also it is possible to strengthen the terminals, because the lining portions of the terminals are bonded to the insulating layer.
1. A terminal structure formed in a wiring trace including an insulating layer and a conductor pattern formed on a surface of the insulating layer, the conductor pattern comprising:
an exposed portion exposed from an aperture formed in part of the insulating layer; and
a lining portion adjacent to the exposed portion in a transverse direction and a longitudinal direction of the conductor pattern and bonded to the insulating layer, such that the exposed portion is less than the full width of the conductor pattern in the transverse direction.
2. A terminal structure according to claim 1 , wherein the aperture is formed through an area of the insulating layer adjacent to the exposed portion in the longitudinal direction of the conductor pattern.
3. A terminal structure according to claim 1 , wherein the area of the lining portion relative to the total area of the area of the exposed portion and the area of the lining portion is in the range of 30% to 70%.
4. A terminal structure according to claim 1 , wherein the lining portion is provided on both sides of the exposed portion in the longitudinal direction of the conductor pattern.
5. A terminal structure according to claim 4 , wherein a through aperture is formed in the exposed portion.
6. A terminal structure according to claim 1 , wherein the conductor pattern includes a first conductor pattern provided with the exposed portion and the lining portion and a second conductor pattern provided with the exposed portion and the lining portion, and the portions of the insulating layer corresponding to the lining portion of the first conductor pattern and the lining portion of the second conductor pattern are connected together on an end side of the wiring trace rather than the lining portions.
7. A terminal structure according to claim 6 , wherein the wiring trace has a second insulating layer formed on the conductor pattern formed on the surface of the insulating layer, and an aperture for exposure of the exposed portions is formed in the second insulating layer.
8. A terminal structure according to claim 7 , wherein the wiring trace has a bent portion, and on the end side rather than the bent portion the exposed portion of the first conductor pattern and the exposed portion of the second conductor pattern are exposed from the aperture as a single aperture formed in the second insulating layer.
9. A terminal structure according to claim 8 , wherein the second insulating layer is divided in two with the bent portion disposed therebetween.
10. A wiring connection structure connecting a flexible printed circuit board and a wiring trace with each other, the flexible printed circuit board including terminals, the wiring trace including an insulating layer and a conductor pattern formed on a surface of the insulating layer,
wherein the conductor pattern includes an exposed portion exposed from an aperture formed in part of the insulating layer and a lining portion bonded to the insulating layer in adjacency to the exposed portion in a transverse direction and a longitudinal direction of the conductor pattern, and the terminals of the flexible printed circuit board and the exposed portion of the conductor pattern are connected to each other, such that the exposed portion is less than the full width of the conductor pattern in the transverse direction.
11. A wiring connection structure according to claim 10 , wherein the flexible printed circuit board and the wiring trace are connected by melting of solder bumps formed on the terminals of the printed circuit board.
12. A wiring connection structure according to claim 11 , wherein the aperture is formed through an area of the insulating layer adjacent to the exposed portion in the longitudinal direction of the conductor pattern, and the solder used in the soldering connects a heating surface and a contact surface of the exposed portion with each other through the through area of the insulating layer.
13. A wiring connection structure according to claim 12 , wherein the exposed portion includes a through aperture, and the solder used in the soldering connects the heating surface and the contact surface of the exposed portion with each other through the through aperture of the exposed portion.
14. A wiring connection structure according to claim 10 , wherein the terminals of the flexible printed circuit board and the exposed portion of the conductor pattern are connected together using ultrasonic waves or by soldering.
15. A wiring connection structure according to claim 10 , wherein a multi-connector including plural the conductor patterns and plural the exposed portions and the lining portions of the conductor patterns is provided on an end side of the wiring trace connected to the flexible printed circuit board.