Miniaturized imaging device with integrated circuit connector system
View Patent ↗A miniaturized imaging device and method of viewing small luminal cavities are described. The imaging device can be used as part of a catheter, and can include a lens, an SSID including an imaging array optically coupled to the lens; an umbilical including a conductive line; and an adaptor configured to support the lens and provide electrical communication between the SSID and conductive line. Alternatively, the adaptor can be a rigid adaptor configured to provide electrical communication between the SSID and the conductive line through a conductive path. The conductive path can be configured along multiple contiguous surfaces of the adaptor such that the SSID is electrically coupled to the conductive path at a first surface, and the conductive line is electrically coupled to the conductive path at a second surface.
1. A stacked, miniaturized imaging device, comprising:
a first layer comprising a substantially planar support member having at least two alignment apertures disposed on opposing sides thereof, the alignment apertures being oriented to position attached conductive wires approximately perpendicular to a top surface of the support member;
a second layer disposed on top of the first layer and comprising a substantially planar chip substrate having at least one imaging array disposed thereon and conductive contact points disposed coplanar with a light receiving surface of the chip substrate;
a third layer comprising a lens adaptor disposed on top of the second layer, the lens adaptor comprising conductive contact points disposed on an outer side surface of the lens adaptor and continuously extending to a bottom surface of the lens adaptor; and
at least one conductive wire disposed within each alignment aperture and positioned to align the three layers in a stacked configuration, the conductive wires extending longitudinally along a corresponding side surface of the chip substrate and the lens adaptor.
2. The stacked, miniaturized imaging device of claim 1 , wherein the lens adaptor comprises a single unitary member in direct contact with the light receiving surface of the chip substrate.
3. The stacked, miniaturized imaging device of claim 1 , wherein the conductive wires are bonded directly to the lens adaptor.
4. The stacked, miniaturized imaging device of claim 1 , wherein the lens adaptor is substantially rectangular in shape having a hollow barrel disposed approximately in the center of the rectangle.
5. The stacked miniaturized imaging device of claim 1 , wherein the alignment apertures are configured to direct the conductive wires to an outer side surface of the lens adaptor.
6. The stacked miniaturized imaging device of claim 1 , wherein the alignment apertures are oriented parallel to a longitudinal axis of the chip substrate.
7. The stacked miniaturized imaging device of claim 1 , wherein the lens adaptor is shaped to approximate the shape of the chip substrate.
8. The stacked miniaturized imaging device of claim 1 , wherein the conductive wires extend across an outer surface of the chip substrate.
9. The stacked miniaturized imaging device of claim 1 , wherein the alignment apertures are positioned on a side surface of the support member.
10. The stacked miniaturized imaging device of claim 1 , wherein the third layer further comprises a GRIN lens disposed within the lens adaptor.
11. A stacked, miniaturized imaging device, comprising:
a first layer comprising a support member having at least one alignment aperture disposed therein, the alignment aperture being oriented to position at least one conductive wire approximately perpendicular to a top surface of the support member;
a second layer disposed on top of the first layer and comprising a chip substrate having at least one imaging array disposed thereon and associated electrical conductive contact points positioned coplanar with a light receiving surface of the chip substrate;
a third layer comprising a lens adaptor disposed on top of the second layer, the lens adaptor being configured to house a GRIN lens therein and further comprising at least one electrical conductive contact point disposed on an outer side surface of the lens adaptor, the at least one electrical conductive contact point continuously extending from a side surface of the lens adaptor to a bottom surface of the lens adaptor; and
at least one conductive wire disposed within the alignment aperture and positioned to align the three layers in a stacked configuration, the conductive wire extending longitudinally along a corresponding side surface of the second and third layers and contacting the at least one electrical conductive contact point disposed on the outer surface of the lens adaptor.
12. The stacked miniaturized imaging device of claim 11 , wherein the GRIN lens is the distal most optical component of the miniaturized imaging device.
13. The stacked miniaturized imaging device of claim 11 , wherein the support member comprises at least two alignment apertures disposed on opposing sides of the support member.
14. The stacked miniaturized imaging device of claim 11 , wherein the support member is substantially planar.
15. The stacked miniaturized imaging device of claim 11 , wherein the longitudinal direction of the alignment aperture is substantially parallel to the longitudinal direction of an image plane of the chip substrate.
16. A stacked, miniaturized imaging device, comprising:
a first layer comprising a substantially planar support member having at least two alignment apertures disposed on opposing sides thereof, the alignment apertures being oriented to position associated conductive wires approximately perpendicular to a top surface of the substantially planar support member;
a second layer disposed on top of the first layer and comprising a substantially planar chip substrate having at least one imaging array disposed thereon and associated conductive contact points thereon;
a third layer comprising a lens support member disposed at least partially on top of the chip substrate, the lens support member being configured to provide lateral support to a lens system; and
at least one conductive wire disposed within each alignment aperture and positioned to align the first and second layers in a stacked configuration, the conductive wires extending longitudinally along a corresponding side surface of the chip substrate and being operatively coupled to the conductive contact points disposed coplanar with a light surface of the chip substrate.
17. The stacked, miniaturized imaging device of claim 16 , further comprising a GRIN lens disposed on a light receiving surface of the chip substrate.
18. The stacked miniaturized imaging device of claim 17 , wherein the lens support member extends from a bottom portion of the GRIN lens to at least a middle portion of the GRIN lens.
19. The stacked miniaturized imaging device of claim 16 , wherein the first, second, and third layers are not substantially wider than 500 microns.