IP Library Granted Patent US 7,755,911
Granted Patent B2
US 7,755,911 · App. 12/081,503 · Granted Jul 13, 2010

Printed wiring board

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Quick Facts
Patent No.
US 7,755,911
App. No.
12/081,503
Granted
Jul 13, 2010
Kind
B2
Abstract

A printed wiring board which can certainly prevent damage of conductive pattern caused by the terminal. The printed wiring board has a board, a conductive pattern, a through-hole and a non-conductive area. A lead wire of resistance mounted on the printed wiring board is inserted into the through-hole 4. The lead wire projects from a surface of the board, and is bent close to the surface. The non-conductive area is formed into a fan-shaped shape enlarging toward a tip of the lead wire from a center of the through-hole. Because the bent lead wire is arranged on the non-conductive area, the non-conductive area can prevent damage of the conductive pattern which is caused by touching the lead wire to the conductive pattern.

Claims (10)

1. A printed wiring board, comprising:

an insulation board;

a conductive pattern arranged on the board and formed into a predetermined circuit;

a through-hole penetrating the board; and

a non-conductive area,

wherein a terminal of an electric component inserted into the through-hole projects from a surface of the board,

wherein the electric component is mounted on the printed wiring board by bending the terminal toward the surface of the board,

wherein the non-conductive area is formed into a shape expanding toward a tip of the terminal of the electric component from a center of the through-hole, and

wherein a bent portion of the terminal is positioned on the non-conductive area such that contact between the bent portion of the terminal and the conductive pattern is securely prevented.

2. The printed wiring board as claimed in claim 1 , wherein the non-conductive area is formed into a fan-shaped shape.

Assignments (1)
CHANGE OF ADDRESS Recorded Jun 5, 2023
From: YAZAKI CORPORATION
To: YAZAKI CORPORATION
Reel/Frame 063845/0802 →