IP Library Granted Patent US 7,763,916
Granted Patent B2
US 7,763,916 · App. 12/081,534 · Granted Jul 27, 2010

Substrate table

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Quick Facts
Patent No.
US 7,763,916
App. No.
12/081,534
Granted
Jul 27, 2010
Kind
B2
Abstract

A substrate table used for manufacturing a chip is provided. The substrate table includes a substrate stage, a substrate placement surface formed on the substrate stage, and on which a substrate is placed, and a guiding member that can project and retract from the substrate placement surface. The guiding member positions the substrate when the guiding member is at a projected position abutting an edge portion of the substrate placed on the substrate placement surface, and the guiding member retracts at a time of applying a tape to the substrate.

Claims (13)

1. A substrate table comprising:

a substrate stage;

a substrate placement surface formed on the substrate stage, and on which a substrate is placed; and

a guiding member able to project and retract from the substrate placement surface, such that the guiding member positions the substrate due to the guiding member at a projected position abutting an edge portion of the substrate placed on the substrate placement surface and a top end of the guiding member is lowered to a level of the substrate placement surface when applying a tape to the substrate.

2. The substrate table of claim 1 , further comprising:

a substrate ring that is ring-shaped; and

a ring guiding member that positions the substrate ring with respect to the substrate,

wherein the substrate ring and the substrate are made integral by the tape being applied thereto.

3. The substrate table of claim 1 , wherein the substrate placement surface projects out from a surface of the substrate stage.

4. The substrate table of claim 1 , further comprising an urging member that urges the guiding member to the projected position.

5. The substrate table of claim 1 , wherein:

the substrate is rectangular-shaped; and

the guiding member comprises a plurality of guide pins, and each side of a first pair of opposing sides of the substrate is positioned by a first number of the plurality of guide pins, and each side of a second pair of opposing sides of the substrate is positioned by a second number of the plurality of guide pins that is less than the first number.

Assignments (3)
CHANGE OF NAME Recorded Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
CHANGE OF NAME Recorded Jan 22, 2009
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022162/0669 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2008
From: MORITA, HIROMI
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 020869/0296 →