IP Library Granted Patent US 7,868,633
Granted Patent B1
US 7,868,633 · App. 12/082,603 · Granted Jan 11, 2011

Modular liquid cooled burn in system

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Quick Facts
Patent No.
US 7,868,633
App. No.
12/082,603
Granted
Jan 11, 2011
Kind
B1
Abstract

An electronic device burn-in thermal management system includes Burn-in-Boards (BIBs) with quick disconnect connectors to easily connect and disconnect the BIB ( 102 ) from liquid cooling lines ( 104, 106 ) in a rack that can hold one or more BIBs. The BIB ( 102 ) may include liquid cooled heat sinks ( 408 ) embedded in the BIB sockets ( 406 ) in order to cool the electronic devices undergoing burn-in test (DUT). This arrangement allows the DUT to make positive thermal contact with the heat sink when it is mounted in the BIB socket and allows the user to remove the BIB ( 102 ) quickly after completing a test to load the next batch of DUTs onto a separate BIB.

Claims (27)

1. A burn-in board, comprising:

an electrical socket for receiving an electrical component;

a liquid cooled heat sink chamber located in thermal proximity to the electrical socket;

an input liquid supply line coupled to a first quick disconnect connector;

an output liquid supply line coupled to a second quick disconnect connector;

the input and output supply lines coupled to the liquid cooled heat sink chamber in order to supply liquid to the liquid cooled heat sink chamber; and

a flip top coupled to the electrical socket and the liquid cooled heat sink chamber is located on the flip top, the flip top including a hinge for allowing the flip top to move into a closed position over the electrical socket.

2. A burn-in board as defined in claim 1 , wherein the liquid cooled heat sink chamber includes a thermal transfer top which is in thermal contact with the electrical outlet.

3. A burn-in board as defined in claim 2 , further comprising a liquid chamber cavity that receives cooling liquid from the input liquid supply line.

4. A burn-in board as defined in claim 3 , wherein the liquid cooled heat sink chamber includes an input coupled to the input liquid supply line for receiving cooling liquid and an output coupled to the output liquid supply line for removing liquid from the liquid chamber cavity.

5. A burn-in board as defined in claim 1 , wherein the first quick disconnect connector is part of a connector that also includes one or more electrical connections.

6. A burn-in board as defined in claim 1 , wherein the liquid cooled heat sink chamber comes into thermal contact with the electrical component when the flip top is closed over the electrical socket.

7. A burn-in board as defined in claim 6 , further comprising a second liquid cooled heat sink located underneath the electrical socket.

8. A burn-in board as defined in claim 7 , wherein the second liquid cooled heat sink is coupled to the input and output liquid supply lines.

9. A burn-in board as defined in claim 1 , wherein the input and output supply lines comprise flexible fluid lines.

10. A liquid cooled socket, comprising

a socket having electrical connections for receiving an electrical component;

a liquid cooled heat sink chamber located in thermal proximity to the electrical socket;

input and output liquid supply lines coupled to the liquid cooled heat sink chamber;

a flip top coupled to the socket including a hinged section; and

the liquid cooled heat sink chamber is located on the flip top hinged section such that when the flip top is closed over the socket, the liquid cooled heat sink chamber comes into thermal contact with the electrical component.

11. A liquid cooled socket as defined in claim 10 , wherein the input and output liquid supply lines are each coupled to quick disconnect connectors.

12. A liquid cooled socket as defined in claim 10 , further comprising:

a second liquid cooled heat sink chamber located on the flip top and underneath the socket.

13. A liquid cooled socket as defined in claim 10 , wherein the socket is located on a burn in board.

14. A liquid cooled socket as defined in claim 10 , wherein the liquid cooled heat sink chamber includes a heat transfer top that is contact with the socket.

15. A liquid cooled socket as defined in claim 10 , wherein the liquid cooled heat sink chamber makes thermal contact with one or more pins located on the electrical component.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2019
From: ASTRONICS TEST SYSTEMS INC.
To: ADVANTEST TEST SOLUTIONS, INC.
Reel/Frame 048388/0363 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 6, 2014
From: EADS NORTH AMERICA, INC.
To: ASTRONICS TEST SYSTEMS INC.
Reel/Frame 032612/0001 →
CHANGE OF NAME Recorded Dec 18, 2010
From: EADS NORTH AMERICA DEFENSE TEST AND SERVICES, INC.
To: EADS NORTH AMERICA, INC.
Reel/Frame 025525/0645 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 12, 2008
From: CHEN, JEFFREY
To: EADS NORTH AMERICA DEFENSE TEST AND SERVICES, INC.
Reel/Frame 020836/0168 →