Thermoplastic Resin Composition with High Thermal Conductivity
There are provided an inorganic compound-containing thermoplastic resin composition that practically retains various properties of a general-purpose resin such as mechanical properties and moldability and has excellent thermal conductivity, and a highly thermally conductive molded article molded using the resin composition. In a polymer alloy comprising a thermoplastic resin excluding a thermoplastic polyester resin, a thermoplastic polyester resin and a highly thermally conductive inorganic compound, the thermoplastic polyester resin forms a continuous phase and the highly thermally conductive inorganic compound is preferentially present in a phase other than the thermoplastic resin excluding a thermoplastic polyester resin. Therefore, the composition and the highly thermally conductive molded article molded using the resin composition can have a thermal conductivity improved only by adding a relatively small amount of the highly thermally conductive inorganic compound.
1 - 9 . (canceled)
10 . A highly thermally conductive thermoplastic resin composition comprising:
a thermoplastic resin excluding a thermoplastic polyester resin (A), a thermoplastic polyester resin (B) and a highly thermally conductive inorganic compound having a thermal conductivity of 1.5 W/m·K or more as a single substance (C),
wherein 1): the volume ratio of the component (A) to the component (B) is 15/85 to 75/25,
2): the volume ratio of the component (C) to the components {(A)+(B)} is 10/90 to 75/25,
3): the ratio of the component (C) present in a phase of the component (A) is a volume fraction of the component (A)×0.4 or less, and
4): at least the component (B) forms a continuous phase structure.
11 . The highly thermally conductive thermoplastic resin composition according to claim 10 , wherein the component (C) is a highly thermally conductive inorganic compound having electrical insulation properties.
12 . The highly thermally conductive thermoplastic resin composition according to claim 10 , wherein the component (C) has a volume average particle size of 1 nm or more and 12 μm or less and is one or more selected from metal oxide fine particles, metal nitride fine particles and insulating carbon fine particles.
13 . The highly thermally conductive thermoplastic resin composition according to claim 10 , wherein the component (C) contains at least one selected from boron nitride, aluminum nitride, silicon nitride, aluminum oxide, magnesium oxide, beryllium oxide and diamond.
14 . The highly thermally conductive thermoplastic resin composition according to claim 10 , wherein the thermoplastic resin excluding a thermoplastic polyester resin (A) is a polycarbonate resin.
15 . The highly thermally conductive thermoplastic resin composition according to claim 10 , wherein the thermoplastic resin excluding a thermoplastic polyester resin (A) is a polyamide resin.
16 . The highly thermally conductive thermoplastic resin composition according to claim 10 , wherein the thermoplastic resin excluding a thermoplastic polyester resin (A) is at least one thermoplastic resin synthesized using a styrene monomer and/or (meth)acrylic monomer.
17 . A highly thermally conductive molded article molded using the highly thermally conductive thermoplastic resin composition according to claim 10 .
18 . The highly thermally conductive molded article according to claim 17 , wherein both the thermoplastic resin excluding a thermoplastic polyester resin (A) and the thermoplastic polyester resin (B) form a continuous phase structure.