IP Library Granted Patent US 7,851,695
Granted Patent B2
US 7,851,695 · App. 12/087,067 · Granted Dec 14, 2010

Stacked-type photoelectric conversion device

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Quick Facts
Patent No.
US 7,851,695
App. No.
12/087,067
Granted
Dec 14, 2010
Kind
B2
Abstract

The present invention makes it possible to provide a stacked-type thin-film photoelectric conversion device having high photostability, at a high yield rate and significantly reduced production costs. In a stacked-type photoelectric conversion device having an amorphous silicon-based photoelectric conversion unit and a crystalline silicon-based photoelectric conversion unit stacked thereon or vice versa, an amorphous photoelectric conversion layer included in the amorphous photoelectric conversion unit has a thickness of at least 0.03 μm and less than 0.17 μm, a crystalline photoelectric conversion layer included in the crystalline photoelectric conversion unit has a thickness of at least 0.2 μm and less than 1.0 μm, and a silicon oxide layer of a first conductivity type included in the amorphous photoelectric conversion unit and a silicon layer of a second conductivity type included in the crystalline photoelectric conversion unit make a junction.

Claims (16)

1. A stacked-type photoelectric conversion device comprising an amorphous silicon-based photoelectric conversion unit and a crystalline silicon-based photoelectric conversion unit stacked thereon or vice versa, wherein

an amorphous photoelectric conversion layer included in said amorphous photoelectric conversion unit has a thickness of at least 0.03 μm and less than 0.17 μm, and a crystalline photoelectric conversion layer included in said crystalline photoelectric conversion unit has a thickness of at least 0.2 μm and not more than 0.7 μm, and

a silicon oxide layer of a first conductivity type included in said amorphous photoelectric conversion unit and a silicon layer of a second conductivity type included in said crystalline photoelectric conversion unit makes a junction, the silicon oxide layer having an oxygen content of at least 35 atomic %,

wherein said silicon oxide layer of the first conductivity type has a thickness of at least 5 nm and less than 20 nm,

wherein a transparent electrode layer, said amorphous photoelectric conversion unit, and said crystalline photoelectric conversion unit stacked in this order on a transparent insulating substrate are separated by a plurality of parallel linear isolation grooves so as to form a plurality of strip-like stacked-type photoelectric conversion cells, and the plurality of cells are electrically connected and integrated in series via a plurality of connection grooves extending in parallel with said isolation grooves.

2. The stacked-type photoelectric conversion device according to claim 1 , wherein said amorphous photoelectric conversion layer is made of silicon-germanium.

3. The stacked-type photoelectric conversion device according to claim 1 , wherein said crystalline photoelectric conversion unit further includes a silicon oxide layer of the first conductivity type on a side of said crystalline photoelectric conversion layer farther from said amorphous photoelectric conversion unit.

4. A stacked-type photoelectric conversion device comprising an amorphous silicon-based photoelectric conversion unit and a crystalline silicon-based photoelectric conversion unit stacked thereon or vice versa, wherein

an amorphous photoelectric conversion layer included in said amorphous photoelectric conversion unit has a thickness of at least 0.03 μm and less than 0.17 μm, and a crystalline photoelectric conversion layer included in said crystalline photoelectric conversion unit has a thickness of at least 0.2 μm and not more than 0.7 μm, and

a silicon oxide layer of a first conductivity type included in said amorphous photoelectric conversion unit and a silicon layer of a second conductivity type included in said crystalline photoelectric conversion unit makes a junction, the silicon oxide layer having an oxygen content of at least 35 atomic %,

wherein said silicon oxide layer of the first conductivity type has a thickness of at least 5 nm and less than 20 nm,

wherein said crystalline photoelectric conversion unit, said amorphous photoelectric conversion unit, and a transparent electrode layer stacked in this order on an insulating substrate are separated by a plurality of parallel linear isolation grooves so as to form a plurality of strip-like stacked-type photoelectric conversion cells, and the plurality of cells are electrically connected and integrated in series via a plurality of connection grooves extending in parallel with said isolation grooves.

5. The stacked-type photoelectric conversion device according to claim 4 , wherein said amorphous photoelectric conversion layer is made of silicon-germanium.

6. The stacked-type photoelectric conversion device according to claim 4 , wherein said crystalline photoelectric conversion unit further includes a silicon oxide layer of the first conductivity type on a side of said crystalline photoelectric conversion layer farther from said amorphous photoelectric conversion unit.

7. The stacked-type photoelectric conversion device according to claim 4 , wherein the silicon oxide layer has electrical conductivity of approximately 10 −9 to 10 −6 S/cm.

8. The stacked-type photoelectric conversion device according to claim 1 , wherein the silicon oxide layer has electrical conductivity of approximately 10 −9 to 10 −6 S/cm.

Assignments (2)
CHANGE OF ADDRESS Recorded Jan 15, 2014
From: KANEKA CORPORATION
To: KANEKA CORPORATION
Reel/Frame 032019/0901 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2008
From: SAWADA, TORU; TAWADA, YUKO; SUEZAKI, TAKASHI; YAMAMOTO, KENJI
To: KANEKA CORPORATION
Reel/Frame 021184/0908 →