Thermoconductive silicone elastomer, thermoconductive silicone elastomer composition and thermoconductive medium

1. A thermoconductive silicone elastomer, the total 100 wt. % of which comprises: 90 to 10 wt. % of a silicone elastomer being a cured body of a hydrosilation-curable organopolysiloxane composition comprising (A) an organopolysiloxane having at least two alkenyl groups in one molecule, (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in one molecule, and (C) a platinum-type catalyst; and the following components dispersed in said silicone elastomer: (D) 0.2 to 5.0 wt. % of a reinforcing fine powder silica; (E) 10 to 90 wt. % of a thermoconductive inorganic powder; and (F) greater than 0 to 10 wt. % of a non-reactive organopolysiloxane that is liquid at room temperature; wherein the cured thermoconductive silicone elastomer has a hardness of 5 to 70 measured by a spring-type hardness tester according to SRIS 0101-1968, a tensile strength above 0.2 MPa according to JIS K 6251, an elongation exceeding 300%, said thermoconductive silicone elastomer demonstrates adherence to a heat-generating member and a heat-radiating member or heat-dissipating member, and said thermoconductive silicone elastomer can be peeled by stretching from a heat-generating member and a heat-radiating member or heat-dissipating member between which said thermoconductive silicone elastomer is sandwiched.

2. The thermoconductive silicone elastomer of claim 1 , wherein said component (A) is a methylvinylpolysiloxane of the following formula:

R 1 3 SiO(R 2 SiO) m SiR 2 3

where R, R 1 and R 2 are methyl or vinyl groups; at least two vinyl groups exist in one molecule; and when all R's in one molecule are methyl groups, at least one of R 1 and at least one of R 2 are vinyl groups; when one R in one molecule is a methyl group, at least one of R 1 and R 2 is a vinyl group; 0.1 to 2% of the total content of both methyl groups and vinyl groups are vinyl groups; and “m” is a number between 50 and 1000; said alkylhydrogenpolysiloxane is a methylhydrogenpolysiloxane; said component (D) is a fumed silica; said component (E) is an alumina powder or a crystalline silica powder; and said non-reactive organopolysiloxane (F) is a methylalkylpolysiloxane or a methyl(perfluoroalkyl)polysiloxane.

3. A thermoconductive hydrosilation-curable silicone elastomer composition, the total 100 wt. % of which comprises: 90 to 10 wt. % of a hydrosilation-curable organopolysiloxane composition comprising (A) an organopolysiloxane having at least two alkenyl groups in one molecule, (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in one molecule, and (C) a platinum-type catalyst; (D) 0.2 to 5.0 wt. % of a reinforcing fine powder silica; (E) 10 to 90 wt. % of a thermoconductive inorganic powder; and (F) greater than 0 to 10 wt. % of a non-reactive organopolysiloxane that is liquid at room temperature; wherein a thermoconductive silicone elastomer prepared by curing said composition has a hardness of 5 to 70 measured by a spring-type hardness tester according to SRIS 0101-1968, a tensile strength above 0.2 MPa according to JIS K 6251, an elongation exceeding 300%, said thermoconductive silicone elastomer demonstrates adherence to a heat-generating member and a heat-radiating member or heat-dissipating member, and can be peeled by stretching from a heat-generating member and a heat-radiating member or heat-dissipating member between which said thermoconductive silicone elastomer is sandwiched.

4. The thermoconductive silicone elastomer composition of claim 3 , wherein said component (A) is a methylvinylpolysiloxane of the following formula:

R 1 3 SiO(R 2 SiO) m SiR 2 3

where R, R 1 and R 2 are methyl or vinyl groups; at least two vinyl groups exist in one molecule; and when all R's in one molecule are methyl groups, at least one of R 1 and at least one of R 2 are vinyl groups; when one R in one molecule is a methyl group, at least one of R 1 and R 2 is a vinyl group; 0.1 to 2% of the total content of both methyl groups and vinyl groups are vinyl groups; and “m” is a number between 50 and 1000; said alkylhydrogenpolysiloxane is a methylhydrogenpolysiloxane; said component (D) is a fumed silica; said component (E) is an alumina powder or a crystalline silica powder; and said non-reactive organopolysiloxane (F) is a methylalkylpolysiloxane or a methyl(perfluoroalkyl)polysiloxane.

5. A thermoconductive medium comprising the thermoconductive silicone elastomer according to claim 1 .

6. A thermoconductive medium comprising the thermoconductive silicone elastomer according to claim 2 .

7. The thermoconductive silicone elastomer of claim 1 , wherein said component (A) is a dimethylpolysiloxane capped at both molecular terminals with dimethylvinylsiloxy groups, a dimethylsiloxane/methylvinylsiloxane copolymer capped at both molecular terminals with trimethylsiloxy groups, a dimethylsiloxane/methylvinylsiloxane copolymer capped at both molecular terminals with dimethylvinylsiloxy groups, or a dimethylsiloxane/methylvinylsiloxane copolymer capped at both molecular terminals with dimethylethoxysiloxy groups.

8. The thermoconductive silicone elastomer of claim 1 , wherein said component (A) is a dimethylpolysiloxane capped at both molecular terminals with dimethylvinylsiloxy groups, the vinyl groups of one molecule constituting 0.1 to 2% of the sum of methyl and vinyl groups; a dimethylsiloxane/methylvinylsiloxane copolymer capped at one molecular terminal with a dimethylvinylsiloxy group and at the other terminal with a trimethylsiloxy group, the vinyl groups of one molecule constituting 0.1 to 2% of the sum of methyl and vinyl groups; or a dimethylsiloxane/methylvinylsiloxane copolymer capped at both molecular terminals with dimethylvinylsiloxy groups, the vinyl groups of one molecule constituting 0.1 to 2% of the sum of methyl and vinyl groups.

9. The thermoconductive silicone elastomer composition of claim 4 , wherein said component (A) is a dimethylpolysiloxane capped at both molecular terminals with dimethylvinylsiloxy groups, a dimethylsiloxane/methylvinylsiloxane copolymer capped at both molecular terminals with trimethylsiloxy groups, a dimethylsiloxane/methylvinylsiloxane copolymer capped at both molecular terminals with dimethylvinylsiloxy groups, or a dimethylsiloxane/methylvinylsiloxane copolymer capped at both molecular terminals with dimethylethoxysiloxy groups.

10. The thermoconductive silicone elastomer composition of claim 4 , wherein said component (A) is a dimethylpolysiloxane capped at both molecular terminals with dimethylvinylsiloxy groups, the vinyl groups of one molecule constituting 0.1 to 2% of the sum of methyl and vinyl groups; a dimethylsiloxane/methylvinylsiloxane copolymer capped at one molecular terminal with a dimethylvinylsiloxy group and at the other terminal with a trimethylsiloxy group, the vinyl groups of one molecule constituting 0.1 to 2% of the sum of methyl and vinyl groups; or a dimethylsiloxane/methylvinylsiloxane copolymer capped at both molecular terminals with dimethylvinylsiloxy groups, the vinyl groups of one molecule should constitute 0.1 to 2% of the sum of methyl and vinyl groups.

11. The thermoconductive silicone elastomer of claim 1 , wherein said component (F) is present in the hydrosilation-curable organopolysiloxane composition in an amount of from 0.1 to 10 wt. %.

12. The thermoconductive silicone elastomer of claim 1 , wherein said component (F) is present in the hydrosilation-curable organopolysiloxane composition in an amount of from 1 to 6 wt. %.

13. The thermoconductive silicone elastomer of claim 1 , wherein said component (F) is a methylalkylpolysiloxane or a methyl(perfluoroalkyl)polysiloxane.

14. The thermoconductive silicone elastomer of claim 1 , wherein said thermoconductive silicone elastomer has a hardness of 7 to 60 measured by a spring-type hardness tester according to SRIS 0101-1968, a tensile strength above 0.5 MPa according to JIS K 6251, and an elongation from 400 to 1500%.

15. The thermoconductive hydrosilation-curable silicone elastomer composition of claim 3 , wherein said component (F) is present in an amount of from 0.1 to 10 wt. %.

16. The thermoconductive hydrosilation-curable silicone elastomer composition of claim 3 , wherein said component (F) is present in an amount of from 1 to 6 wt. %.

17. The thermoconductive hydrosilation-curable silicone elastomer composition of claim 3 , wherein said component (F) is a methylalkylpolysiloxane or a methyl (perfluoroalkyl)polysiloxane.

18. The thermoconductive hydrosilation-curable silicone elastomer composition of claim 3 , wherein said thermoconductive silicone elastomer has a hardness of 5 to 60 measured by a spring-type hardness tester according to SRIS 0101-1968, a tensile strength above 0.5 MPa according to JIS K 6251, and an elongation from 400 to 1500%.

19. An article comprising:

a heat-generating member;

a heat-radiating member or a heat-dissipating member disposed opposite said heat-generating member; and

a thermoconductive medium sandwiched between said heat-generating member and said heat-radiating member or said heat-dissipating member;

wherein said thermoconductive medium comprises a thermoconductive silicone elastomer, the total 100 wt. % of which comprises: 90 to 10 wt. % of a silicone elastomer being a cured body of a hydrosilation-curable organopolysiloxane composition comprising (A) an organopolysiloxane having at least two alkenyl groups in one molecule, (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in one molecule, and (C) a platinum-type catalyst; and the following components dispersed in said silicone elastomer: (D) 0.2 to 5.0 wt. % of a reinforcing fine powder silica; (E) 10 to 90 wt. % of a thermoconductive inorganic powder; and (F) greater than 0 to 10 wt. % of a non-reactive organopolysiloxane that is liquid at room temperature;

wherein said thermoconductive medium has a hardness of 5 to 70 measured by a spring-type hardness tester according to SRIS 0101-1968, a tensile strength above 0.2 MPa according to JIS K 6251, an elongation exceeding 300%;

wherein said thermoconductive medium demonstrates adherence to said heat-generating member and said heat-radiating member or heat-dissipating member; and

wherein said thermoconductive medium can be peeled by stretching from said heat-generating member and said heat-radiating member or heat-dissipating member between which said thermoconductive medium is sandwiched.

20. The article of claim 19 , wherein said component (A) is a methylvinylpolysiloxane of the following formula:

R 1 3 SiO(R 2 SiO) m SiR 2 3

where R, R 1 and R 2 are methyl or vinyl groups; at least two vinyl groups exist in one molecule; and when all R's in one molecule are methyl groups, at least one of R 1 and at least one of R 2 are vinyl groups; when one R in one molecule is a methyl group, at least one of R 1 and R 2 is a vinyl group; 0.1 to 2% of the total content of both methyl groups and vinyl groups are vinyl groups; and “m” is a number between 50 and 1000; said component (D) is a fumed silica; said component (E) is an alumina powder or a crystalline silica powder; and said component (F) is a methylalkylpolysiloxane or a methyl(perfluoroalkyl)polysiloxane.

21. An article comprising:

a heat-generating member;

a heat-radiating member or a heat-dissipating member disposed opposite said heat-generating member; and

a thermoconductive medium sandwiched between said heat-generating member and said heat-radiating member or said heat-dissipating member;

wherein said thermoconductive medium is formed from a thermoconductive hydrosilation-curable silicone elastomer composition, the total 100 wt. % of which comprises: 90 to 10 wt. % of a hydrosilation-curable organopolysiloxane composition comprising (A) an organopolysiloxane having at least two alkenyl groups in one molecule, (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in one molecule, and (C) a platinum-type catalyst; (D) 0.2 to 5.0 wt. % of a reinforcing fine powder silica; (E) 10 to 90 wt. % of a thermoconductive inorganic powder and (F) greater than 0 to 10 wt. % of a non-reactive organopolysiloxane that is liquid at room temperature;

wherein said thermoconductive medium has a hardness of 5 to 70 measured by a spring-type hardness tester according to SRIS 0101-1968, a tensile strength above 0.2 MPa according to JIS K 6251, an elongation exceeding 300%;

wherein said thermoconductive medium demonstrates adherence to said heat-generating member and said heat-radiating member or heat-dissipating member; and

wherein said thermoconductive medium can be peeled by stretching from said heat-generating member and said heat-radiating member or heat-dissipating member between which said thermoconductive medium is sandwiched.

22. The article of claim 21 , wherein said component (A) is a methylvinylpolysiloxane of the following formula:

R 1 3 SiO(R 2 SiO) m SiR 2 3

where R, R 1 and R 2 are methyl or vinyl groups; at least two vinyl groups exist in one molecule; and when all R's in one molecule are methyl groups, at least one of R 1 and at least one of R 2 are vinyl groups; when one R in one molecule is a methyl group, at least one of R 1 and R 2 is a vinyl group; 0.1 to 2% of the total content of both methyl groups and vinyl groups are vinyl groups; and “m” is a number between 50 and 1000; said component (D) is a fumed silica; said component (E) is an alumina powder or a crystalline silica powder; and said component (F) is a methylalkylpolysiloxane or a methyl(perfluoroalkyl)polysiloxane.